DuPont Highlighted New Products at iMAPS Conference

DuPont Electronic Technologies was pleased to participate in the recent iMAPS Conference, held March 21 – 22, 2006 in Scottsdale, AZ. Our booth showcased EKC Technology and Advanced Packaging Lithography product offerings.

EKC introduced a new Wafer Level Packaging Photoresist Remover, WLP EKC108™. This product is designed for use in spray processing equipment and wet benches and is optimized to effectively remove thick negative resists and eliminate UBM etch masking.

DuPont Advanced Packaging Lithography promoted the features and benefits of its MPF Polymer Films. The WB Series dry photoresists provides reliable film applications, effective trimming around wafers, and precise and uniform polymer coating for thick and ultrathick wafer bumping applications.

For more information on these products, you can go to ekctech.com and advpackaging.dupont.com.