DuPont Electronic Technologies will once again participate in the IMAPS Device Packaging Conference 2008. The conference provides a focused forum on the latest technological developments related to microelectronics packaging: FlipChip/CSP; 3D Packaging; Optoelectronics; MEMS; and Biomedical.   »More

DuPont will feature its flexible printed circuit offering at Internepcon Japan Printed Wiring Board Expo.   »More

DuPont    Advanced Packaging Lithography was part of  "Small-Dimensions – Big Results", a tour hosted by SUSS MicroTec to highlight recent developments in MEMS, Advanced Packaging and 3-D Integration.   »More

DuPont will feature its expanding portfolio of advanced packaging materials at SEMICON Europa 2007. This year's show will be held at the Stuttgart Trade Fair Center in Stuttgart, Germany on October 9-11, 2007.   »More

DuPont Electronic Technologies is pleased to announce that we will once again be participating in the Device Packaging Conference 2007. At this year’s conference, we will spotlight our thin and thick film offerings for wafer level packaging, WLP photoresist removers from EKC Technology, and Interra™ embedded passive materials.  »More

DuPont Electronic Technologies (ET) in Research Triangle Park, NC recently hosted The International Wireless Industry Consortium, as part of an interactive technical workshop on handset technologies for multi-mode, multi-band cell phone antenna designs, sponsored by Sony Ericsson.  »More

DuPont Electronic Technologies was pleased to participate in the recent iMAPS Conference, held March 21 – 22, 2006 in Scottsdale, AZ. Our booth showcased EKC Technology and Advanced Packaging Lithography product offerings.   »More