The miracles of science™

Select Industry


Advanced Packaging Lithography
Advanced Packaging Lithography Home
Products & Services
Sales & Support
News & Events
Technical Info
CONTACT US
Printer Friendly Version
DuPont Products & Services
DuPont Brands & Trademarks

News & Events

March 2, 2009 DuPont highlights Wafer Level Packaging Solutions at IMAPS Device Packaging 2009 Conference DuPont will feature new ultra-low cure dielectric materials for WLP and 3D/TSV applications, and spotlight advanced material sets and process technologies for Fan Out, 3D/TSV, RDL, Bonding and Bumping applications. Two technical papers and two interactive poster sessions will be presented by DuPont at the event. »More

September 23, 2008DuPont Electronic Technologies Expands Wafer Level Packaging Solutions DuPont Electronic Technologies has announced a new expansion focused on material solutions for wafer level packaging (WLP) and emerging three dimensional (3D) and Through Silicon Via (TSV) semiconductor packaging applications »More

June 23, 2008DuPont to Feature Semiconductor Materials at SEMICON West 2008 DuPont will exhibit its portfolio of advanced material technologies for semiconductor fabrication and packaging at SEMICON West in San Francisco, July 15-17, 2008. »More

June 11, 2008DuPont Electronic Technologies Announces Global Price Increase DuPont Electronic Technologies cites rising raw material, transportation and energy costs among its reasons for the increase. »More

May 5, 2008DuPont will participate in the Symposium on Polymers for Microelectronics The Symposium On Polymers for Microelectronics is one of the foremost comprehensive technical meetings for the integration and processing of polyimides and new polymeric films for advanced microelectronic applications. »More

May 2, 2008DuPont to Feature Wafer Level Packaging Offerings at ECTC 2008 DuPont Electronic Technologies will display its expanding portfolio of laminates, thick films, photoresists and removers for semiconductor packaging at the Electronic Components and Technology Conference. »More

March 4, 2008 DuPont Advanced Packaging Lithography Announces Commercial Availability of WBR 2000 Series Films for Advanced Semiconductor Packaging DuPont™ WBR 2000 Series dry film photoresists deliver improved resolution, speed and consistent resist thickness across the wafer, as well as simpler processing and a reduced environmental footprint.   »More

February 25, 2008 DuPont to Showcase Semiconductor Materials at Semicon China 2008 DuPont will feature its portfolio of innovative materials and process expertise for the semiconductor industry at Semicon China 2008.   »More

February 19, 2008 DuPont To Present Technical Papers at 2008 IMAPS Device Packaging Conference

DuPont Electronic Technologies will once again participate in the IMAPS Device Packaging Conference 2008. The conference provides a focused forum on the latest technological developments related to microelectronics packaging: FlipChip/CSP; 3D Packaging; Optoelectronics; MEMS; and Biomedical.   »More

January 8, 2008 DuPont to Exhibit at Internepcon 2008

DuPont will feature its flexible printed circuit offering at Internepcon Japan Printed Wiring Board Expo.   »More

January 2, 2008 DuPont Participated in Advanced Packaging Technology Roadshow in Asia

DuPont    Advanced Packaging Lithography was part of  "Small-Dimensions – Big Results", a tour hosted by SUSS MicroTec to highlight recent developments in MEMS, Advanced Packaging and 3-D Integration.   »More

September 17, 2007 DuPont to Showcase Semiconductor Materials at SEMICON Europa 2007

DuPont will feature its expanding portfolio of advanced packaging materials at SEMICON Europa 2007. This year's show will be held at the Stuttgart Trade Fair Center in Stuttgart, Germany on October 9-11, 2007.   »More

March 19, 2007 DuPont To Present Technical Papers at 2007 Device Packaging Conference

DuPont Electronic Technologies is pleased to announce that we will once again be participating in the Device Packaging Conference 2007. At this year’s conference, we will spotlight our thin and thick film offerings for wafer level packaging, WLP photoresist removers from EKC Technology, and Interra™ embedded passive materials.  »More

February 19, 2007 Picking Up the Latest Trend in Cell Phones

DuPont Electronic Technologies (ET) in Research Triangle Park, NC recently hosted The International Wireless Industry Consortium, as part of an interactive technical workshop on handset technologies for multi-mode, multi-band cell phone antenna designs, sponsored by Sony Ericsson.  »More

March 22, 2006 DuPont Highlighted New Products at iMAPS Conference

DuPont Electronic Technologies was pleased to participate in the recent iMAPS Conference, held March 21 – 22, 2006 in Scottsdale, AZ. Our booth showcased EKC Technology and Advanced Packaging Lithography product offerings.   »More