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Advanced Packaging Lithography

DuPont Advanced Packaging Lithography offers a diversified product line, with tailored formulations to respond to the technological demands of semiconductor packaging and MEMs processing. Our products include dry film photoresists and advanced co-designed removers from DuPont EKC Technology. Our offering of photoresist films and formulations provide an easy to alternative to liquid photoresist processing that saves time, and results in high yields.

 
WB Series

Non permanent photoresist films with thickness ranging from 50 to 120 microns, designed for wafer bumping applications.

 

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MX Series

Non permanent photoresist films designed for RDL, TSV, lift off and other MEMS applications. These films are available in a range of 15-20 micron thicknesses.

 

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PerMX Series

Permanent photoresist films designed for a variety of applications. These films are available in a range of 10-20 micron thicknesses.

 

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