DuPont™ Pinnacle® herbicide controls selected broadleaf weeds in soybeans and field tomatoes, including lamb’s-quarters.

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DuPont™ Pinnacle® SG herbicide controls selected broadleaf weeds in soybeans and field tomatoes.

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A specially formulated polyimide precursor solution, featuring high-purity and high-heat resistance.

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DuPont Teijin Films™ (DTF), the world’s leading supplier of polyester films, offers PV module manufacturers a number of films for deposition substrate, frontsheet and backsheet applications used in rigid and flexible thin film modules.

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DuPont™ Prism® herbicide is a trusted choice for outstanding post-emergent control of quackgrass, redroot pigweed and annual grassy weeds in potatoes and field tomatoes.

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DuPont Soy Polymers offers a line of functional soy-based additives that can be formulated as the sole adhesive component or in combination with other materials/binders in water-based adhesive applications.

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DuPont™ Pronone® herbicide, a Group-5 herbicide, is the ultimate weed control solution for lowbush blueberries.

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A vitamin and mineral fortified isolated soy protein with no cholesterol and virtually no fats or carbohydrates.

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Encapsulants are among the most important materials to module manufacturers for high volume module sealing and integration. Choosing the right material not only speed module production but can significantly prolong power generating efficiency and module durability.

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Encapsulants are among the most important materials to module manufacturers for high volume module sealing and integration. Choosing the right material not only speed module production but can significantly prolong power generating efficiency and module durability.

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Pyralin® coatings are moderately viscous solutions of polyimide precursors in polar aprotic solvents such as NMP. These solutions are designed to be applied by spin coating on semiconductor wafers or other flat substrates to provide thin films after curing at 350 degrees Centigrade.

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Pyralux® bonding films include Coverlays which consist of DuPont™ Kapton® polyimide film coated on one side with adhesive, and Bondplys which are coated on both sides. Our Pyralux® Adhesive films are coated onto release paper used primarily to bond flexible inner layers or rigid cap layers in multilayer circuits.

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At the forefront of the industry for decades, DuPont™ Pyralux® continues to be the laminate of choice for the advanced flex circuitry required in today’s demanding display applications. Offering unrivaled material and deployment flexibility combined with excellent dimensional stability and high modulus clads, DuPont™ Pyralux® enables the cost-effective and reliable manufacture of both traditional and innovative new display technologies.

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Flexible, solderable, metal-clad laminates, coverlays and bonding adhesives for the flexible circuit industry.

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Pyralux® laminates come in a broad range of copper, dielectric and adhesive thicknesses and are available as adhesive based or adhesiveless constructions.

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