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DuPont™ Polyguide™

Polymeric wave guide systems technology.

 

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Particlear® flocculants for use in watering systems

Particlear™ is a new technology to bring an environmentally friendly silica-based flocculant to the water and wastewater treatment industry. Learn more about applications in poultry processing, beef processing, and municipal water.

 

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Pinnacle®

Enhanced broadleaf control.

 

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PIQ™

A specially formulated polyimide precursor solution, featuring high-purity and high-heat resistance.

 

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Plas-Stick® surface prep agents

Surface prep, cleaners and sealers used to create adhesion and flexibility on plastic substrates in the automotive industry.

 

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Prism®

A herbicide applied post-emergence to potatoes to control grass and broadleaf weeds.

 

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Pro-Cote® soy polymers

DuPont Soy Polymers offers a line of functional soy-based additives that can be formulated as the sole adhesive component or in combination with other materials/binders in water-based adhesive applications.

 

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PROBOX® seed handling system

Hard-sided container for the transport and storage of seed products in bulk.

 

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Pronone®

Pro-Serve, Inc.'s Pronone® 10G granular herbicide is a special granular product to be distributed on the soil surface for selective control of certain weeds and brush.

 

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Proplus® Brand Isolated Soy Protein

A vitamin and mineral fortified isolated soy protein with no cholesterol and virtually no fats or carbohydrates.

 

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Pyralin®

Pyralin® coatings are moderately viscous solutions of polyimide precursors in polar aprotic solvents such as NMP. These solutions are designed to be applied by spin coating on semiconductor wafers or other flat substrates to provide thin films after curing at 350 degrees Centigrade.

 

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Pyralux® Coverlay, Bondply & Sheet Adhesive

Pyralux® bonding films include Coverlays which consist of DuPont™ Kapton® polyimide film coated on one side with adhesive, and Bondplys which are coated on both sides. Our Pyralux® Adhesive films are coated onto release paper used primarily to bond flexible inner layers or rigid cap layers in multilayer circuits.

 

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Pyralux® flexible laminates

Flexible, solderable, metal-clad laminates, coverlays and bonding adhesives for the flexible circuit industry.

 

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Pyralux® polymide laminates

Pyralux® laminates come in a broad range of copper, dielectric and adhesive thicknesses and are available as adhesive based or adhesiveless constructions.

 

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