Polymeric wave guide systems technology.

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Particlear™ is a new technology to bring an environmentally friendly silica-based flocculant to the water and wastewater treatment industry. Learn more about applications in poultry processing, beef processing, and municipal water.

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Enhanced broadleaf control.

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A specially formulated polyimide precursor solution, featuring high-purity and high-heat resistance.

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Surface prep, cleaners and sealers used to create adhesion and flexibility on plastic substrates in the automotive industry.

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DuPont Teijin Films™ (DTF), the world’s leading supplier of polyester films, offers PV module manufacturers a number of films for deposition substrate, frontsheet and backsheet applications used in rigid and flexible thin film modules.

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A herbicide applied post-emergence to potatoes to control grass and broadleaf weeds.

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DuPont Soy Polymers offers a line of functional soy-based additives that can be formulated as the sole adhesive component or in combination with other materials/binders in water-based adhesive applications.

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Hard-sided container for the transport and storage of seed products in bulk.

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Pro-Serve, Inc.'s Pronone® 10G granular herbicide is a special granular product to be distributed on the soil surface for selective control of certain weeds and brush.

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A vitamin and mineral fortified isolated soy protein with no cholesterol and virtually no fats or carbohydrates.

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Encapsulants are among the most important materials to module manufacturers for high volume module sealing and integration. Choosing the right material not only speed module production but can significantly prolong power generating efficiency and module durability.

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Encapsulants are among the most important materials to module manufacturers for high volume module sealing and integration. Choosing the right material not only speed module production but can significantly prolong power generating efficiency and module durability.

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Pyralin® coatings are moderately viscous solutions of polyimide precursors in polar aprotic solvents such as NMP. These solutions are designed to be applied by spin coating on semiconductor wafers or other flat substrates to provide thin films after curing at 350 degrees Centigrade.

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Pyralux® bonding films include Coverlays which consist of DuPont™ Kapton® polyimide film coated on one side with adhesive, and Bondplys which are coated on both sides. Our Pyralux® Adhesive films are coated onto release paper used primarily to bond flexible inner layers or rigid cap layers in multilayer circuits.

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At the forefront of the industry for decades, DuPont™ Pyralux® continues to be the laminate of choice for the advanced flex circuitry required in today’s demanding display applications. Offering unrivaled material and deployment flexibility combined with excellent dimensional stability and high modulus clads, DuPont™ Pyralux® enables the cost-effective and reliable manufacture of both traditional and innovative new display technologies.

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Flexible, solderable, metal-clad laminates, coverlays and bonding adhesives for the flexible circuit industry.

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Pyralux® laminates come in a broad range of copper, dielectric and adhesive thicknesses and are available as adhesive based or adhesiveless constructions.

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