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C
CMP & Wafer Polishing Slurries

Chemical Mechanical Planarization (CMP) is used with different materials at different levels within the chip. The main layers being planarized with CMP slurries are Cu, Cu barrier (Ta/TaN), W, ILD, STI, Polysilicon and PMD layers.

 

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Corian®

An acrylic-based premium solid surface material offering easy maintenance, superior resistance to damage and outstanding aesthetics.

 

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Dry Chamber Cleaning Gases & Plasma Etch Solutions

Cleaning is an important process to ensure the yield. DuPont provides chemicals for dry chamber cleaning.

 

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