|
|
L
Advanced Packaging Lithography Materials
A new family of permanent and non-permanent photopolymer films designed for wafer applications in advanced semiconductor packaging, including wafer bumping for flip chip, backside wafer coating and other wafer level packaging applications.
» More
DuPont Liquid Packaging Systems
Extending food and beverage shelf life, preserving freshness and taste, and delivering nourishment are a few of the many ways DuPont Liquid Packaging Systems helps our customers meet the needs of the dairy, beverage, bottled water, food and wine industries.
» More
DuPont™ Lateral Flow System™
The DuPont™ Lateral Flow System™ is a simple and inexpensive alternative to traditional culture methods for routinely screening foods for pathogens.
» More
Laminate Materials for PCBs
DuPont has a growing porfolio of permanent materials: DuPont™ Teflon® PTFE aqueous dispersions used in low loss laminates, DuPont™ Thermount® non-woven aramids in low CTE laminates and now thin DuPont™ Interra™ polyimide laminates for embedded capacitance applications.
» More
|
|
|