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DuPont/Epson Publication Paper

Color proofing media specifically designed for the Epson Stylus Pro 5000. Provides more control of color earlier in the print production process.

 

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DuPont™ Polyguide™

Polymeric wave guide systems technology.

 

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DuPont™/Epson™ Commercial Matte Paper

Color proofing media specifically designed for the Epson Stylus Pro 5000. Provides more control of color earlier in the print production process.

 

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Para-Phenylenediamine

Intermediate in performance resins and fibers, and a curing agent for high-temperature composites. Also used in formulation of hair dyes, urethane coatings, rubber chemicals and textile dyes and pigments.

 

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Particlear® flocculants for use in watering systems

Particlear™ is a new technology to bring an environmentally friendly silica-based flocculant to the water and wastewater treatment industry. Learn more about applications in poultry processing, beef processing, and municipal water.

 

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PHI Financial Services (PHIFS)

Financing of seed and crop protection services.

 

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PHI Insurance Services (PHIS)

Crop insurance.

 

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PHI Marketing Services

Marketing services.

 

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Pinnacle®

Enhanced broadleaf control.

 

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PIQ™

A specially formulated polyimide precursor solution, featuring high-purity and high-heat resistance.

 

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Plas-Stick® surface prep agents

Surface prep, cleaners and sealers used to create adhesion and flexibility on plastic substrates in the automotive industry.

 

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Polyimide Films for Stress Buffers

Polyimide films are frequently used as a "stress buffer" or protective overcoat for semiconductors. Polyimide stress buffers are typically 4-6 microns in thickness, and protect the delicate thin films of metal and oxides on the chip surface from damage during handling and from induced stress after encapsulation in plastic molding compound.

 

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Post Etch Residue Removers

Aqueous & Semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes used in the microelectronics industry.

 

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Pouch

Three to 64 U.S. fluid oz (90 ml to 21) pouches.

 

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Powder Coatings (Industrial)

Thermosetting and polymer powders which offer optimum coating as well as economic and ecological advantages.

 

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Precision Farming Services/Emerging Technologies

Global Positioning System (GPS), Geographic Information Systems (GIS) mapping, crop data management.

 

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Primer Surfacer

Protective layer between the electrodeposition coating and topcoat.

 

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Prism®

A herbicide applied post-emergence to potatoes to control grass and broadleaf weeds.

 

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Pro-Cote® soy polymers

DuPont Soy Polymers offers a line of functional soy-based additives that can be formulated as the sole adhesive component or in combination with other materials/binders in water-based adhesive applications.

 

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Pro-Tech 400 Plus™

A high-gauge film (1 to 4 mils) manufactured from premium polyethylene resins which offers an environment-compatible, economical and high-protection packaging solution in applications where conventional stretch film does not perform. As it is stretched, film strength increases. It is 100 percent recyclable and helps reduce total package volume.

 

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PROBOX® seed handling system

Hard-sided container for the transport and storage of seed products in bulk.

 

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Pronone®

Pro-Serve, Inc.'s Pronone® 10G granular herbicide is a special granular product to be distributed on the soil surface for selective control of certain weeds and brush.

 

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Proplus® Brand Isolated Soy Protein

A vitamin and mineral fortified isolated soy protein with no cholesterol and virtually no fats or carbohydrates.

 

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Putties

Premium quality, two-component polyester fine finishing putty used to fill surface defects too large to be filled by primers.

 

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Pyralin®

Pyralin® coatings are moderately viscous solutions of polyimide precursors in polar aprotic solvents such as NMP. These solutions are designed to be applied by spin coating on semiconductor wafers or other flat substrates to provide thin films after curing at 350 degrees Centigrade.

 

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Pyralux® Coverlay, Bondply & Sheet Adhesive

Pyralux® bonding films include Coverlays which consist of DuPont™ Kapton® polyimide film coated on one side with adhesive, and Bondplys which are coated on both sides. Our Pyralux® Adhesive films are coated onto release paper used primarily to bond flexible inner layers or rigid cap layers in multilayer circuits.

 

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Pyralux® flexible laminates

Flexible, solderable, metal-clad laminates, coverlays and bonding adhesives for the flexible circuit industry.

 

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Pyralux® polymide laminates

Pyralux® laminates come in a broad range of copper, dielectric and adhesive thicknesses and are available as adhesive based or adhesiveless constructions.

 

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