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DuPont/Epson Publication Paper

Color proofing media specifically designed for the Epson Stylus Pro 5000. Provides more control of color earlier in the print production process.

 

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Para-Phenylenediamine

Intermediate in performance resins and fibers, and a curing agent for high-temperature composites. Also used in formulation of hair dyes, urethane coatings, rubber chemicals and textile dyes and pigments.

 

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PHI Financial Services (PHIFS)

Financing of seed and crop protection services.

 

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PHI Insurance Services (PHIS)

Crop insurance.

 

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PHI Marketing Services

Marketing services.

 

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Pinnacle® herbicide

DuPont™ Pinnacle® herbicide controls selected broadleaf weeds in soybeans and field tomatoes, including lamb’s-quarters.

 

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Pinnacle® SG herbicide

DuPont™ Pinnacle® SG herbicide controls selected broadleaf weeds in soybeans and field tomatoes.

 

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PIQ™

A specially formulated polyimide precursor solution, featuring high-purity and high-heat resistance.

 

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Polyester Films by DuPont Teijin Films™ for Photovoltaics

DuPont Teijin Films™ (DTF), the world’s leading supplier of polyester films, offers PV module manufacturers a number of films for deposition substrate, frontsheet and backsheet applications used in rigid and flexible thin film modules.

 

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Polyimide Films for Stress Buffers

Polyimide films are frequently used as a "stress buffer" or protective overcoat for semiconductors. Polyimide stress buffers are typically 4-6 microns in thickness, and protect the delicate thin films of metal and oxides on the chip surface from damage during handling and from induced stress after encapsulation in plastic molding compound.

 

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Post Etch Residue Removers

Aqueous & Semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes used in the microelectronics industry.

 

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Precision Farming Services/Emerging Technologies

Global Positioning System (GPS), Geographic Information Systems (GIS) mapping, crop data management.

 

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PrecisionPac™ herbicides

Every farm is unique. Every field is different. Now, you can get completely customized weed control with DuPont™ PrecisionPac® herbicides. Buy exactly the amount you need and choose from 12 different high-performing herbicide blends that match your agronomic needs.

 

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Prism® herbicide

DuPont™ Prism® herbicide is a trusted choice for outstanding post-emergent control of quackgrass, redroot pigweed and annual grassy weeds in potatoes and field tomatoes.

 

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Pro-Cote® soy polymers

DuPont Soy Polymers offers a line of functional soy-based additives that can be formulated as the sole adhesive component or in combination with other materials/binders in water-based adhesive applications.

 

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Pronone® herbicide

DuPont™ Pronone® herbicide, a Group-5 herbicide, is the ultimate weed control solution for lowbush blueberries.

 

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Proplus® Brand Isolated Soy Protein

A vitamin and mineral fortified isolated soy protein with no cholesterol and virtually no fats or carbohydrates.

 

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PV1000 Series EVA Resins

Encapsulants are among the most important materials to module manufacturers for high volume module sealing and integration. Choosing the right material not only speed module production but can significantly prolong power generating efficiency and module durability.

 

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PV5200 & PV5300 Series Encapsulant Sheets

Encapsulants are among the most important materials to module manufacturers for high volume module sealing and integration. Choosing the right material not only speed module production but can significantly prolong power generating efficiency and module durability.

 

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Pyralin®

Pyralin® coatings are moderately viscous solutions of polyimide precursors in polar aprotic solvents such as NMP. These solutions are designed to be applied by spin coating on semiconductor wafers or other flat substrates to provide thin films after curing at 350 degrees Centigrade.

 

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Pyralux® Coverlay, Bondply & Sheet Adhesive

Pyralux® bonding films include Coverlays which consist of DuPont™ Kapton® polyimide film coated on one side with adhesive, and Bondplys which are coated on both sides. Our Pyralux® Adhesive films are coated onto release paper used primarily to bond flexible inner layers or rigid cap layers in multilayer circuits.

 

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Pyralux® Flexible Circuit Materials

At the forefront of the industry for decades, DuPont™ Pyralux® continues to be the laminate of choice for the advanced flex circuitry required in today’s demanding display applications. Offering unrivaled material and deployment flexibility combined with excellent dimensional stability and high modulus clads, DuPont™ Pyralux® enables the cost-effective and reliable manufacture of both traditional and innovative new display technologies.

 

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Pyralux® flexible laminates

Flexible, solderable, metal-clad laminates, coverlays and bonding adhesives for the flexible circuit industry.

 

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Pyralux® polymide laminates

Pyralux® laminates come in a broad range of copper, dielectric and adhesive thicknesses and are available as adhesive based or adhesiveless constructions.

 

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