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p-Phenylenediamine (PPD)
PPD is a low toxicity diamine used as a component of engineering polymers and composites, aramid fibers, hair dyes, rubber chemicals, textile dyes and pigments.
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Particlear® flocculants for use in watering systems
Particlear™ is a new technology to bring an environmentally friendly silica-based flocculant to the water and wastewater treatment industry. Learn more about applications in poultry processing, beef processing, and municipal water.
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PerMX Series permanent microlithographic polymer films
DuPont PerMx Series is a new version of permanent microlithographic polymer films. PerMx is designed for a variety of applications, including redistribution, bonding and structuring. These films are available in a range of 15-20 micron thicknesses.
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Photosensistive Liquid Polyimide and PBO Formulations
Polyimide or PBO films, from HD MicroSystems, are formed by spin coating and used as a dielectric, or as a "stress buffer" protective overcoat for semiconductors prior to encapsulation. Several photodefineable formulations can also serve a photoresist in back-of-the-line and packaging applications.
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Plantex® Pro
The DuPont™ Plantex® Pro line utilizes all of the gardening and landscape expertise and innovation by DuPont, making it the smartest way to build a superior landscape.
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Polymer Thick Film Pastes - CB Series
Used on high density printed wiring boards to enhance both thermal and
electrical conductivity for various applications including buried vias or
printed wiring boards with microvia layers. Combining these properties with
copper and carbon products for flexible and rigid circuit applications the
CB Series offers shielding against electro-magnetic interference (EMI)
providing up to 30 percent cost savings compared with traditional EMI
shielding options.
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Polymers for Photoresists
From a captive raw material base, we began producing poly(hydroxystyrene) based polymers in the early 1980’s. Since this time, we have developed a deep understanding of polymer assembly and architecture.
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Pool Care System
Everything you need to know for easy and effective pool care. This easy to use system shows you, week by week, month by month, exactly what you need to do to keep your pool sparkling clear and ready to use.
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Post Etch Residue Removers
Aqueous & Semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes used in the microelectronics industry.
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Prequel™ herbicide
Prequel™ is a burndown plus residual corn herbicide that controls winter annuals, early spring grasses and broadleaf weeds. It delivers more control under more conditions to help keep corn clean through the critical weed-free period.
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Primer
The primer layer is the coating layer that joins a corrosion-protected substrate to the topcoat. It functions to smooth out surface irregularities, improve stone-chip performance, and helps to protect the substrate from visible and UV light.
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Pro-Cote® soy polymers
DuPont Soy Polymers offers a line of functional soy-based additives that can be formulated as the sole adhesive component or in combination with other materials/binders in water-based adhesive applications.
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ProShield® 1 protective apparel
A three-layer spunbonded-meltblown-spunbonded polypropylene fabric that is useful for protection against non-hazardous materials and when repellency from non-hazardous light liquid splash is needed.
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ProShield® 2 protective apparel
A unique composite of breathable film and nonwoven fabric that provides an excellent protective barrier against particles and many toxic liquids.
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ProTect® baseclear
Two component etch and scratch resistant baking clear used over waterborne basecoats.
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ProTect® clear
Two component etch and scratch resistant baking clear used over waterborne basecoats.
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Protera™ fabric
When your work involves the risk of electric arc hazards, protection and safety come first. DuPont™ Protera™ fabric meets NFPA 70E Category 2 requirements and the protection won’t wash or wear away.
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Provaunt® insecticide
Provaunt® insecticide is a water dispersible granular that may be applied as a foliar or broadcast spray to control lepidopterous larvae (such as armyworms, cutworms, sod webworms, bagworms, fall webworms, gypsy moth caterpillars, tent caterpillars, tussock moth caterpillars, yellownecked caterpillars) and certain other pests on landscape and recreational (including golf course) turfgrass and landscape ornamentals including trees, shrubs, foliage plants, flowers and non-bearing fruit and nut trees, which will not produce a raw agricultural commodity during the season of application.
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Punch™ fungicide
DuPont™ Punch™ soybean fungicide is available for use on soybeans for the control of Asian soybean rust through Section 18 quarantine exemptions.
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PV1000 Series EVA resins
Encapsulants are among the most important materials to module manufacturers for high volume module sealing and integration. Choosing the right material not only speed module production but can significantly prolong power generating efficiency and module durability.
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PV5200 & PV5300 Series encapsulant sheets
Encapsulants are among the most important materials to module manufacturers for high volume module sealing and integration. Choosing the right material not only speed module production but can significantly prolong power generating efficiency and module durability.
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Pyralux® coverlay, bondply, & sheet adhesive
Pyralux® bonding films include Coverlays which consist of DuPont™ Kapton® polyimide film coated on one side with adhesive, and Bondplys which are coated on both sides. Our Pyralux® Adhesive films are coated onto release paper used primarily to bond flexible inner layers or rigid cap layers in multilayer circuits.
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Pyralux® flexible circuit materials
The Pyralux® family of products include flexible, solderable, metal clad laminates, coverlays, and bonding adhesives for the fabrication of thin, solderable, high density electrical interconnects. These are used to make circuitry for single and double-sided, multilayer flex and rigid-flex applications.
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Pyralux® polyimide laminates
Pyralux® laminates come in a broad range of copper, dielectric and adhesive thicknesses and are available as adhesive based or adhesiveless constructions.
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