Water Filters.

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Basecoats which use water to achieve application viscosity.

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DuPont Clean Agent Fire Extinguishants are intended to prevent or extinguish fires in situations where conventional extinguishing agents such as water, dry chemical, and carbon dioxide are unacceptable. They are safe to use where people are present, non-corrosive, non-conductive, and safer for the environment.

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WaterProof® is the breakthrough proofing technology of the decade. It works well at the highest resolutions, with a level of detail and accuracy in print prediction that other analog proofing systems can't match.

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With DuPont's WaterProof® Thermal Halftone Proofing, you will see the accurate color print prediction and resolution that WaterProof® is known for.

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MPF films for wafer bumping, are excellent in both photo stencil and electroplating processes. These wafer bumping films are available in a range of 50-120 microns thicknesses.

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Series of non permanent photoresist films with thickness ranging from 50 to 125 microns, designed for wafer bumping applications.

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Whether your investigation involves product/material samples or more complex components, we can provide you with the high-quality weathering, testing and consulting you need.

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The distortion-free, head-up display (HUD) communicates driver-selected information, such as navigation, performance features as well as vehicle speed to the driver.

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Our Weed Control Fabric provides a strong weapon against weeds while helping to promote healthy plants and shrubs.

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Westar™ is an effective herbicide providing both contact and residual control of many annual and perennial weeds.

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With more than 12 soft red winter and soft white winter varieties, Pioneer® brand wheat offer growers the convenience of bagged wheat with the agronomic package that fit their needs.

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DuPont™ Sontara® wiping products are engineered to be exceptional wiping tools. That’s why they are used around the world in key industries like aviation, automotive refinish, food service, life sciences, and printing – plus a variety of maintenance and manufacturing applications. Our unique hydroentangling technology ensures that Sontara® is highly absorbent, low-linting, exceptionally strong, and solvent-resistant.

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EKC162™ WLP photo resist remover and the new WBR 2000 dry film resist were co-developed to work with the HD MicroSystems PI and PBO redistribution dielectrics to take the burden of lengthy qualification / integration of products off the customers' shoulders.

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Formulations optimized to effectively remove liquid or dry film photoresists used for Through Silicon Via (TSV) masks and Wafer Level Packaging (WLP) applications like wafer bumping by electroplating or stencil printing. TSV cleaners are designed to be compatible with copper and to effectively remove residues after TSV etch.

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DuPont offers a complete line of Personal Protective Equipment (PPE) that helps to protect against toxic chemicals, biological toxins, and military warfare agents.

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With DuPont™ Fusabond® polymer modifiers, you can create natural/wood plastic composite and other wood alternative products that are stronger, maintain their integrity through freeze/thaw cycles and have the impact resistance to withstand the rigors or heavy traffic.

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