SD Flex Company, a 50/50 joint venture between DuPont Electronic Technologies and Cheil Industries, Inc., part of the Samsung Group, recently completed the construction of a new manufacturing facility for Pyralux® adhesiveless flexible copper clad laminate (FCCL), the material instrumental in enabling advanced functionality and performance in displays, cell phones, personal digital assistants (PDAs) and other electronic devices.

SD Flex Company hosted a ceremony to celebrate the opening.

"The successful completion of the SD Flex manufacturing facility is key to meeting the strong market demand for FCCL, and to maintaining the global leadership position we have established in the industry," said D S Kim, president, DuPont Asia Pacific. In late 2004, the joint venture was formed and SD Flex Company immediately began construction on the manufacturing facility at Cheil’s existing site in Gumi, Korea. FCCL manufacturing technology, licensed from DuPont Wirex, reduces the layers in a flexible circuit from three to two, by eliminating an adhesive layer that prohibits maximum circuit density and flexibility and is often a cause of vulnerability to circuit failure.

Currently the business is focused on producing Pyralux® flexible laminates for export, and plans to begin sales for the Korean market early next year. Initial capacity for FCCL at SD Flex is 100,000 square meters per month, and may be expanded to keep pace with market demand.