Matsushita Electric Industrial Co. Adopts New DuPont™ Fodel® 8G Conductor System from DuPont Microcircuit Materials
Removing Ruthenium Provides Lower Cost and Improved Image for Plasma Display Panel Manufacturers
DuPont Microcircuit Materials, part of DuPont Electronic Technologies, today announced the adoption of the newest DuPont™ Fodel® 8th Generation (8G) photoimageable thick-film pastes by Matsushita Electric Industrial Co.(MEI). MEI utilizes the technology in its latest line of Panasonic VIERA® Plasma televisions, which feature full high-definition resolution and superior image quality. DuPont™ Fodel® 8G pastes are used in the metallization of the plasma display panel (PDP) front bus electrodes in order to improve image quality and achieve substantial cost savings through dramatically reduced precious metal content. MEI is a world leader in flat panel TV technology with the largest global market share in the plasma TV market.
"DuPont™ Fodel® 8G is yet another example of how DuPont Microcircuit Materials supports PDP manufacturers such as MEI in introducing process simplifications and cost reductions that achieve more attractive price targets for larger TV sizes that are competitive with LCDs," said Walt Cheng, global business director, DuPont Microcircuit Materials.
The DuPont™ Fodel® 8G photoimageable thick film system is ideally suited for 42” and greater full high-definition PDPs which require exceptionally high resolution, yet must remain cost effective to manufacture. Fodel® technology provides a simple, high yield and highly scaleable process for fine-line patterning of conductor lines on plasma glass panels. The 8G system completely replaces the ruthenium pyrochlore-based black pigments used in previous generations of the Fodel® system with a novel and proprietary black pigment system based entirely on lower cost metals. This has been accomplished while simultaneously improving the overall system’s performance including resistivity, blackness, processing margin and latitude and cycle time.
"We see the complete elimination of ruthenium precious metal in the new Fodel® 8G paste system as a major step change that will help our customers become even more competitive in the future,” said Cheng.
DuPont Microcircuit Materials has over 40 years of experience in the development, manufacture, sale, and support of specialized thick film compositions for a wide variety of electronic applications in the display, photovoltaic, automotive, biomedical, industrial, military, and telecommunications markets. For more information about DuPont™ Fodel® photoimageable thick-film pastes, visit mcm.dupont.com. Microcircuit Materials is part of DuPont Electronic Technologies, a leading supplier of electronic materials, including materials for the fabrication and packaging of semiconductors, materials for hybrid, rigid and flexible circuits, and materials for advanced displays.
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