DuPont is developing next-generation PDP metallization technology for the flat panel display market. TMT is a dry film-based process for performing patterned metallization of substrates, with resolution that exceeds what is currently possible with other thick film deposition approaches. TMT is scalable to large-glass substrate sizes and easily automatable for high yield and low cost of ownership. TMT is currently in its beta-site commercialization stage.
Features and Benefits
Ultra fine lines with resolution down to 20 microns Low resistivity and low material consumption Fully dry process with no need for printing solvents or development Rapid process to reduce cycle time and capital investment Environmentally friendly process with fully lead-free materials
For more information on DuPont TMT Technology, contact your regional representative.
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