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2008

September 23, 2008DuPont Electronic Technologies Expands Wafer Level Packaging Solutions DuPont Electronic Technologies has announced a new expansion focused on material solutions for wafer level packaging (WLP) and emerging three dimensional (3D) and Through Silicon Via (TSV) semiconductor packaging applications »More

July 11, 2008DuPont EKC Technology Introduces New EKC162™ Photoresist Remover for Advanced Semiconductor Packaging EKC Technology will introduce a new photoresist remover for Through Silicon Via (TSV) and Wafer Level Packaging (WLP) for copper pillar and solder bump applications at SEMICON West. »More

June 23, 2008DuPont to Feature Semiconductor Materials at SEMICON West 2008 DuPont will exhibit its portfolio of advanced material technologies for semiconductor fabrication and packaging at SEMICON West in San Francisco, July 15-17, 2008. »More

June 11, 2008DuPont Electronic Technologies Announces Global Price Increase DuPont Electronic Technologies cites rising raw material, transportation and energy costs among its reasons for the increase. »More

May 2, 2008DuPont to Feature Wafer Level Packaging Offerings at ECTC 2008 DuPont Electronic Technologies will display its expanding portfolio of laminates, thick films, photoresists and removers for semiconductor packaging at the Electronic Components and Technology Conference. »More

 

February 25, 2008  DuPont to Showcase Semiconductor Materials at Semicon China 2008 DuPont will feature its portfolio of innovative materials and process expertise for the semiconductor industry at Semicon China 2008.   »More

February 19, 2008DuPont To Present Technical Papers at 2008 IMAPS Device Packaging Conference DuPont Electronic Technologies will once again participate in the IMAPS Device Packaging Conference 2008. The conference provides a focused forum on the latest technological developments related to microelectronics packaging: FlipChip/CSP; 3D Packaging; Optoelectronics; MEMS; and Biomedical.   » More

January 2, 2008DuPont Participated in Advanced Packaging Technology Roadshow in Asia DuPont    Advanced Packaging Lithography was part of  "Small-Dimensions – Big Results", a tour hosted by SUSS MicroTec to highlight recent developments in MEMS, Advanced Packaging and 3-D Integration.   » More

2007

September 17, 2007DuPont Showcased Semiconductor Materials at SEMICON Europa 2007 DuPont  featured its expanding portfolio of advanced packaging materials at SEMICON Europa 2007. This year's show was held at the Stuttgart Trade Fair Center in Stuttgart, Germany on October 9-11, 2007.   » More

August 29, 2007 DuPont Featured Semiconductor Materials at Semicon Taiwan 2007 DuPont showcased its expanding portfolio of semiconductor fabrication and advanced packaging materials at Semicon Taiwan 2007.   » More

July 17, 2007Semicon West 2007 Technology Innovation Showcase features DuPont EKC Technology "DuPontTM CuSolveTM EKC520TM – An Environmentally Sustainable Solution for Cu / Low-k Cleaning of Advanced Technology Devices" was presented as part of the Semicon West 2007 Challenges in Device Scaling TechXPOT.   » More

July 11, 2007DuPont Electronic Technologies Formalizes Interconnect Collaboration with IMEC DuPont Electronic Technologies today announced that the company has joined IMEC as an Industrial Affiliate in 45nm and 32 nm technology development programs on cleaning, contamination control and advanced interconnects.   » More

March 19, 2007DuPont To Present Technical Papers at 2007 Device Packaging Conference DuPont Electronic Technologies is pleased to announce that we will once again be participating in the Device Packaging Conference 2007. At this year’s conference, we will spotlight our thin and thick film offerings for wafer level packaging, WLP photoresist removers from EKC Technology, and Interra™ embedded passive materials.   » More

2006

July 24, 2006 DuPont Opens Semiconductor Materials Technical Center in Taiwan As part of its strategic plan for long term growth in the semiconductor materials market, DuPont Electronic Technologies has established a Semiconductor Materials Technical Center in Taiwan's Hsinchu Science Park.   » More

July 11, 2006 DuPont EKC Technology Introduces New Family of Products for Copper Interconnect Cleaning at SEMICON West 2006 DuPont EKC Technology, part of DuPont Electronic Technologies, today announced the introduction of a new series of products for the BEOL (Back End of Line) cleaning of copper interconnects in semiconductors.   » More