EKC PCMP5510™ for Copper Post-CMP Cleaning EKC PCMP5510™ offers a manufacturing-proven, low cost-of-ownership copper post CMP cleaner featuring a neutral pH formulation for Cu BEOL. This single chemistry solution can be used with acidic or basic barrier slurries; provides very low defectivity on copper and low-k surfaces; offers enhanced compatibility with sensitive low-k films; and can be used with advanced barrier films with excellent corrosion resistance. EKC PCMP5510™ offers flexibility in dilution to meet low cost-of-ownership targets for all equipment cleaning modules. » Find Out More
EKC4000™ PCT
EKC4000™ PCT is a cost effective replacement that outperforms conventional "rinse" chemistries such as IPA and NMP. It quickly and effectively eliminates corrosion on the wafer surface caused by drag-out (carry over) of chemistry from prior wet cleaning. EKC4000™ PCT is compatible with automatic equipment and is formulated to meet ULSI grade specifications for advanced wafer treatment.
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