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DuPont EKC Technology is a leading manufacturer of specialty chemicals used in the removal of photoresist and post-dry etch process residue. Our products provide best in class process solutions for wafer cleaning, surface preparations, post CMP cleaning and post-etch residue/photoresist removal, enabling higher productivity, finer lines and improved yields. Explore our product offerings below.

Photoresist Removers

Organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces.

 

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Post Clean Treatments

Post clean treatments specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step.

 

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Post CMP Cleaners

Post CMP cleaning is a yield enhancing process step that removes defects deposited during the planarization process.

 

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Post-Etch Residue Removers

Aqueous & Semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.

 

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Removers for LED Fabrication

Solutions formulated for the removal of positive- and negative-tone photoresists as well as plasma-hardened residues, compatible with a variety of metals required to form contacts for light emitting diodes (LEDs).

 

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Wafer Level Packaging Photoresist Removers & TSV Cleaners

Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printing. TSV masks and TSV cleaners are designed to effectively remove residues after TSV etch.

 

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