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EKC Technology is the leading manufacturer of specialty chemicals used in the removal of photoresist and post-dry etch process residue. We are recognized as "Best in Class" within the semiconductor device, disk drive and panel display markets.

Our products provide process solutions for wafer cleaning, surface preparations, post CMP cleaning and post-etch residue/photoresist removal, enabling higher productivity, finer lines and improved yields. Explore our product offerings below.

 
Post-Etch Residue Removers

Aqueous & Semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.

 

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Photoresist Removers

Organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces.

 

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Wafer Level Packaging Photoresist Removers

Formulations optimized to effectively remove thick negative liquid resists used for wafer bumping by solder electroplating or stencil printing.

 

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Post CMP Cleaners

Post CMP cleaning is a yield enhancing process step that removes defects deposited during the planarization process.

 

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Post Clean Treatments

Post clean treatments specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step.

 

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Edge Bead Removers

Proprietary mixture of high purity organic solvents formulated for the removal of polyimide edgebead.

 

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Choline Hydroxide in Water (45%)

Ingredient used in photoresist stripper formulations for Printed Wire Board (PWB) applications.

 

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