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Copper Integration Technology

EKC505™ CuEKC505™ Cu is solvent based and designed for complete removal of photoresist in the presence of low-k dielectric and exposed copper without damage.

EKC520™ CuEKC520™ Cu is formulated specifically for advanced designs integrating copper. EKC520™ Cu cleans copper containing residue in the presence of exposed copper and low-k dielectrics with no damage to substrates.