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Post-Etch Residue Removers

PlasmaSolv® Products - HDA® Technology

PlasmaSolv® products are designed to remove post etch residue. These products perform at low operating temperatures, well below the flashpoint of the chemistry, providing a safe chemical process as well as extending bath life.

 

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Copper Integration Technology

CuSolve™ products are copper compatible cleaning products formulated specifically for advanced designs integrating copper. These products remove photoresist and copper containing residues in the presence of exposed copper and low-k materials.

 

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SAC™ (semi-aqueous chemistry) Remover

The Semi-Aqueous Chemistry (SAC™) series of products comprise the industry’s most effective solution to the cleaning of etch residue at or below critical dimensions of 0.25µm. Used at ambient temperature for short process times, SAC™ products eliminate W plug failures and facilitate advanced interconnect by complete cleaning of both subtractive etch and damascene structures.

 

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