WLP EKC162™ is a formulation optimized to effectively remove thick and thin photo resists used for TSV masks and wafer bumping by solder electroplating or stencil printing with superior bath life and wafer capacity. The product is designed for use in spray processing equipment and wet benches and is capable of removing resist faster and at a lower temperature than the competition.
EKC175™ completely and efficiently removes tough post-etch residues formed from DRIE TSV processes, enabling a defect free via filling process.
EKC830™ is ideal for the effective removal of DuPont MX5000 Series Dry Film where Al is present. This product can be used in spray processing equipment and wet benches.