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Wafer Level Packaging Photoresist Removers & TSV Cleaners

Application  Intended Use Product
Photo resist removal for wafer bumping by solder electroplating or stencil printing DuPont Dry Film
removal and dissolution 		 EKC162™ Resist Remover
Liquid resist removal and dissolution   EKC162™ Resist Remover
DuPont MX5000 Series Dry Film removal where Al is present  EKC830™ 
TSV Mask Removal

Complete removal of DuPont MX5000 Series Dry Film used as TSV mask.

EKC162™ resist remover
TSV Post-etch Residue Remover

Complete removal of post-etch residue after TSV etch.

EKC265™ post-etch residue remover

WLP EKC162™

WLP EKC162™ is a formulation optimized to effectively remove thick and thin photo resists used for TSV masks and wafer bumping by solder electroplating or stencil printing with superior bath life and wafer capacity. The product is designed for use in spray processing equipment and wet benches and is capable of removing resist faster and at a lower temperature than the competition.

EKC265™

EKC265™ completely and efficiently removes tough post-etch residues formed from DRIE TSV processes, enabling a defect free via filling process.

EKC830™

EKC830™ is ideal for the effective removal of DuPont MX5000 Series Dry Film where Al is present. This product can be used in spray processing equipment and wet benches.