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March 15, 2010
DuPont Circuit & Packaging Materials Opens New Technical Lab in China This multi-functional lab will enable faster and more efficient technical support for CPM customers in the electronics industry in China, and provide a facility for new product development and process evaluation. »More

March 4, 2010DuPont to Feature New Products at IPC APEX Expo 2010 New technologies on display will include dry film photoresists and phototooling films for printed circuit board (PCB) imaging, flexible circuit materials, embedded resistor materials and new screen printed inks for PCB fabrication. »More

February 26, 2010
DuPont Exhibits at CPCA 2010 Shanghai, China DuPont will be featuring its broad offering of technologies for the Printed Circuit Board (PCB) industry at CPCA 2010 in Shanghai, China, March 16 - 18, 2010. »More

April 8, 2009 DuPont Printed Circuit Materials Introduces New Riston® LaserSeries Films New Laser Direct Imaging Films Deliver on Demanding Printed Wiring Board Applications at 355 & 405 nm »More

June 11, 2008DuPont Electronic Technologies Announces Global Price Increase DuPont Electronic Technologies cites rising raw material, transportation and energy costs among its reasons for the increase. »More

March 6, 2008 DuPont Printed Circuit Materials Celebrates 40 Years of Innovation with Riston®The newest additions to the portfolio include DuPont™ Riston® LDI7000 Laser Direct Imaging (LDI) dry film photoresist for direct imaging tent-and-etch applications, and DuPont™ Riston® PlateMaster 300 dry film photoresist, designed for fine feature pattern plating.   »More


February 19, 2007 Picking Up the Latest Trend in Cell PhonesDuPont Electronic Technologies (ET) in Research Triangle Park, NC recently hosted The International Wireless Industry Consortium, as part of an interactive technical workshop on handset technologies for multi-mode, multi-band cell phone antenna designs, sponsored by Sony Ericsson.   »More


January 18, 2007 DuPont Semiconductor Packaging and Circuit Materials Participated in InterNepcon JapanDuPont showcased its expanding portfolio of materials for Semiconductor Packaging and Circuit Materials at InterNepcon Japan 2007.   »More


March 27, 2006 DuPont Printed Circuit Materials and Agfa Specialty Products Announce Asian Distribution Agreement for New Idealine™ Phototooling Films DuPont will distribute the new Agfa Idealine™ brand silver halide phototooling films and chemicals to Printed Wiring Board (PWB) fabricators in the Americas, and throughout most of Asia.   »More

January 26, 2006 DuPont Sponsored the EIPC Winter Conference in Budapest, Hungary Among other excellent speakers, DuPont presented the latest yield and performance enhancing photoresist technology that is already helping leading companies to profit and differentiation.   »More