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March 6, 2008 DuPont Printed Circuit Materials Celebrates 40 Years of Innovation with Riston®

The newest additions to the portfolio include DuPont™ Riston® LDI7000 Laser Direct Imaging (LDI) dry film photoresist for direct imaging tent-and-etch applications, and DuPont™ Riston® PlateMaster 300 dry film photoresist, designed for fine feature pattern plating.   »More

February 19, 2007 Picking Up the Latest Trend in Cell Phones

DuPont Electronic Technologies (ET) in Research Triangle Park, NC recently hosted The International Wireless Industry Consortium, as part of an interactive technical workshop on handset technologies for multi-mode, multi-band cell phone antenna designs, sponsored by Sony Ericsson.   »More

January 18, 2007 DuPont Semiconductor Packaging and Circuit Materials Participated in InterNepcon Japan

DuPont showcased its expanding portfolio of materials for Semiconductor Packaging and Circuit Materials at InterNepcon Japan 2007.   »More

March 27, 2006 DuPont Printed Circuit Materials and Agfa Specialty Products Announce Asian Distribution Agreement for New Idealine™ Phototooling Films DuPont will distribute the new Agfa Idealine™ brand silver halide phototooling films and chemicals to Printed Wiring Board (PWB) fabricators in the Americas, and throughout most of Asia.   »More

January 26, 2006 DuPont Sponsored the EIPC Winter Conference in Budapest, Hungary Among other excellent speakers, DuPont presented the latest yield and performance enhancing photoresist technology that is already helping leading companies to profit and differentiation.   »More