Budapest, Hungary, January 26, 2006
DuPont Sponsors EIPC Winter Conference in Budapest, Hungary
DuPont was a proud sponsor and speaker at the EIPC Winter Conference in Budapest, Hungary, on January 26 & 27, 2006. The theme of the conference was "Survival through technology leadership and innovation". The aim of the Winter Conference was to provide a platform for speakers and delegates to exchange information on market conditions and future innovation on interconnection and packaging.
Among other excellent speakers, DuPont presented the latest yield and performance enhancing photoresist technology that is already helping leading companies to profit and differentiation. This conference is an absolute ‘must’ for companies associated with PCB fabrication who wish to stay up to date with the latest market requirements, materials, fabrication equipment and manufacturing processes who also need to improve the efficiency of their processes and the reliability of their products.
Download presentation - Get Wet and Improve Your Innerlayer Yields