DuPont to Present Paper at 2007 PCMI Spring Conference

DuPont is pleased to announce that Karl Dietz, Technology Manager, DuPont Semiconductor Packaging & Circuit Materials, will present a technical presentation at the upcoming PCMI Spring Conference. This year’s conference will be held on April 23-24 at Massachusetts Institute of Technology Hotel in Cambridge, MA.

PCMI represents a broad cross-section of all segments of the Photo Chemical Machining Industry's technology. It includes manufacturers and users of photo chemically machined parts, as well as companies that supply raw materials, equipment and services used to produce its products. The purpose of the PCMI organization is to monitor developments in photo chemical machining and to address problems that may affect the process or the industry worldwide. PCMI has member companies in 20 countries on 6 continents.

Karl’s presentation, titled "New Imaging Technologies" is scheduled for Monday, April 23 at 1:45 pm. An abstract of the presentation is below:

This presentation will introduce the concept of image or pattern transfer in electronic packaging, with examples such as photolithography for the formation of circuit patterns, the creation of drill patterns from CAD data, soldermask structuring, and legend printing. A brief review of conventional imaging techniques will then open up the discussion of novel patterning methods. This will include a variety of methods involving the use of lasers, applications of inkjetting, and the formation of embedded, or recessed, circuit features that allow high resolution, good surface planarity, and improved adhesion of circuit lines to the adjacent dielect.

For more information on PCMI, or the 2007 Spring Conference, please visit http://www.pcmi.org/.