DuPont to Feature Expanded Material Offering at Productronica 2007

DuPont Electronic Technologies will display its expanding portfolio of laminates and imaging materials for electronic applications at Productronica 2007 on November 13-16.  The conference this year will be held at the New Munich Trade Fair Center in Munich, Germany.

The DuPont booth (B-3, Booth 326) will feature four unique product lines:

DuPont Imaging Materials will highlight several offerings in the dry film photoresist market, as well as Introduce new products for photoresist and fine feature imaging:

• Riston® Platemaster 300 for fine feature imaging
• Riston® JSF for Semi-Additive Plating
• Riston® LDI800 specially designed for 405nm LDI

DuPont™ CooLam™ Metal Core Printed Circuit Boards (MC PCB) offer unique thermal management properties to LED packaging applications.

DuPont™ Interra™ Embedded Passive Materials offer planar capacitor laminates and thick film capacitors and resistors for increased performance in smaller electronic components.

DuPont™ Pyralux® Flexible Circuit Materials will feature Pyralux® AP copper clad laminates, offering outstanding reliability, gigahertz speed and excellent electrical properties in demanding applications.

For more information on Productronica 2007, please visit productronica.com