DuPont began formulating specialized photoresists for Laser Direct Imaging (LDI) over 20 years ago, and continues to lead the industry with its Riston® LaserSeries films. Ultra fast photospeed, high performance, and compatibility with conventional printed wiring board (PWB) processes are critical to help PWB fabricators optimize their LDI equipment investments.
For specialty outerlayer plating applications on 355nm direct imaging equipment, exposure productivity and plating latitude enhance throughput and yields.
This high productivity film is fully aqueous, possesses ultra-fast photospeed and is compatible with both acid and alkaline etching.
Customized for tent and etch processes with 355nm direct imaging equipment, with excellent tenting strength, resolution and adhesion with fast stripping that contributes to higher yield and productivity.
Riston® LDI7200 is designed to provide superior performance on today's LDI imaged outerlayer boards. The broad capability of the film in a broad range of plating solutions (copper, tin, solder, nickel and gold) and the availablity in thicknesses ranging from 40 microns to 100 microns, gives the fabricator one film to meet all of their imaging needs.
Riston® LDI7200 benefits include:
Developed for 405 nm LDI equipment, with fast photospeed (13mJ/cm2~) and excellent resolution with wide exposure latitude. Riston® LDI8000 features good conformity, a vivid printout image and strong tenting with excellent hold time stability.
Contact us to learn more about how Riston® LDI films can help you improve your yields.