The demands on printed circuit manufacturers are continually increasing as the market demands finer features. DuPont™ Riston® PlateMaster was formulated to achieve consistently high yields by providing outstanding plated line uniformity, fine line resolution, and wide surface tolerance on direct metallization and panel plate. In addition to high yields, PlateMaster was designed to give the fabricator robust process latitude.
PM340, 35µm L/S
Excellent Conformation on 10µm of Copper Bump
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Riston® PM300 is the next generation fine line copper/tin and copper/solder plating film. Excellent resolution and wide processing latitude give the pwb fabricator the ability to produce the ever more demanding plated feaures for the designs of today and tomorrow.
Riston® PM300 benefits include:
- Fine line capability
- Excellent conformation
- Easy stripping
- No sludge formulation
Riston® PlateMaster PM200 is an industry proven film providing high yields and high productivity for plating of copper, tin and lead. Clean development and stripping on a wide variety of surfaces facilitates high yield. Riston® PM200 is available worldwide in 40 micron, 50 micron, 75 micron thicknesses.
