|Robust adhesion and high productivity. For volume production of outerlayers in Cu, Sn, Sn/Pb plating.
|Next generation plating film with improved fine-line adhesion and superior adhesion.
|Thick plating resist for selective Cu, Sn/Pb and Ni/Au plating.
|General purpose resist with high productivity, easy stripping. Alkaline etch and strong gold plating performance.
|General purpose resist. Strong performance in high pH alkaline etch and aggressive gold plating.
|Wide latitude alkaline etch and gold plating performance.
|Acid Etch, Chemical Milling
||High productivity, fine-line innerlayer perfoamce. Wet lam compatible.
||High productivity innerlayer film. Strong chem milling performance.
|Thin resist for chemical milling and acid etch.
|Acid Etch, Tent & Etch
|Good conformation and reliable performance acid etch innerlayers. Reliable tenting for tent & etch processes.
|Fine Line Etching (innerlayer and tent & etch) and plating
|High tech/Fine line resist for below 75 µm lines/spaces. Excellent flow during lamination and insensitive to off-contact printing.
||Specialty product for selective e-less Ni/Au plating.
|Semi-additive Circuit Formation
||Specialty product for semi-additive packaging applications. Superior adhesion to smooth copper.
|Laser Direct Imaging
|Specialty film for Laser Direct Imaging. 30 micron for acid etching; 40 and 50 micron for general purpose applications.
||Specialty product for Laser Direct Imaging. Ultra high photospeed.
|Specialty product tent-and-etch and print-and-etch for Laser Direct Imaging. Superior tenting and adhesion.
|Specialty product tent-and-etch and print-and-etch for Laser Direct Imaging. Cu/Sn,Cu/SnPb,Ni/Au plating.