DuPont™ Interra Embedded Passive Materials™ will co-host the Embedded Technology Seminar along with Oak-Mitsui on May 16, 2008 at the Tokyo Conference Center Shinagawa.

At the seminar, Dr. Jun Kim, Applications Development Specialist, will present DuPont Embedded Capacitor Solutions: Driving miniaturization, cost reduction and improved electrical performance in a range of digital and wireless applications

Abstract:
The presentation will include DuPont planar capacitor laminate, Interra™ HK 04, and the recently commercialized Interra™ 200 nF/cm-sq discrete embedded capacitor material.  Example applications will be shared along with guidance to explain when embedded capacitance may be an appropriate solution. 

Interra™ HK 04 is a polyimide dielectric based buried capacitance laminate with dielectric thicknesses of 25, 18 and 12 micron.  HK 04 is being qualified in a range of high-layer count (>16) printed circuit boards (PCBs) used in servers, telecom, routers and military systems.  HK 04 has been adopted due to improved signal integrity (especially for wide single ended buses such as DDR-2 and DDR-3), but more importantly it is gaining popularity for cost reduction purposes. We will share examples of cost-reduction options that this technology presents.

As opposed to HK 04 which is used primarily in printed wiring boards, DuPont Interra™ EP310 is a 200 nF/cm-sq discrete embedded capacitor material which is used in 1^st level packaging – RF modules and digital flip-chip packages.  Rf module applications are driven primarily by miniaturization and cost-reduction, while digital flip-chip applications are driven primarily by improved signal integrity. This talk will share recent manufacturability and reliability data on integrating these materials in a package/module, We will also share results on expected cost reduction and signal integrity improvements from a variety of RF module, DSP, ASIC and MCU applications.

In addition to DuPont and Oak-Mitsui presentations, this seminar will feature presentations and exhibitions from Sanmina, NEC, OK Print, AET and other PCB industry leaders.

For more information, please visit http://www.mitsui-kinzoku.co.jp/event/index.html