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July 6, 2009Pyralux® APR Recognized for New Product Rollout DuPont Pyralux® APR embedded resistor laminate was featured in the Printed Circuit Design & Fab June Supplier Spotlight for receiving a 2009 New Product Introduction Award, recognizing APR as a leading new product for printed circuit design and fabrication based on innovation and creativity, compatibility with existing technology, cost-effectiveness, environmental consideration, performance and user-friendliness. »More

February 22, 2009New Technical Paper - PCB Power Delivery Optimizations for the Cost Driven Era Printed Circuit Board (PCB) level power delivery involves choices in: PCB laminates, construction, bypass capacitor selection, and placement. This new technical paper, presented at DesignCon 2009, examines currently available choices as they apply to realizing high performance power delivery while optimizing manufactured cost. Results are demonstrated using test vehicles built with current generation ICs. » Download Paper

February 3, 2009DuPont High Performance Laminates Introduces Pyralux® APR Copper Clad Resistor Laminate DuPont expands its portfolio of embedded materials and all polyimide laminates with the introduction of DuPont™ Pyralux® APR copper clad resistor laminate for advanced multi-layer flex, rigid flex and rigid printed circuit boards. » More

June 11, 2008DuPont Electronic Technologies Announces Global Price Increase DuPont Electronic Technologies cites rising raw material, transportation and energy costs among its reasons for the increase. »More

April 30, 2008Interra™ Will Co-host Embedded Technology Seminar At the seminar, Dr. Jun Kim, Applications Development Specialist, will present "DuPont Embedded Capacitor Solutions: Driving miniaturization, cost reduction and improved electrical performance in a range of digital and wireless applications". »More

April 29, 2008DuPont™ Interra™ to Participate in PCB East 2008 Visit DuPont Booth 302 to learn about our Interra™ embedded passive materials for the design of advanced printed circuit boards. »More

March 18, 2008DuPont Technical Paper Wins Award at ECWC 11 in Shanghai Dr. Karl H. Dietz, Technology Manager, DuPont Electronic Technologies presented "Integration of Embedded Capacitors into Flip-chip Substrate Structures for Improved Power System Noise Decoupling and Charge Supply to the IC" at ECWC. »More

 

February 19, 2008DuPont To Present Technical Papers at 2008 IMAPS Device Packaging Conference DuPont Electronic Technologies will once again participate in the IMAPS Device Packaging Conference 2008. The conference provides a focused forum on the latest technological developments related to microelectronics packaging: FlipChip/CSP; 3D Packaging; Optoelectronics; MEMS; and Biomedical. »More

 

July 20, 2007IMAPS Advanced Technology Workshop on Integrated Embedded Passives to Feature Presentations from DuPont This workshop will feature the latest papers on integrating resistors, capacitors, and inductors into leading edge applications. and will focus on all aspects of passive integration. »More

 

March 19, 2007DuPont To Present Technical Papers at 2007 Device Packaging Conference DuPont Electronic Technologies is pleased to announce that we will once again be participating in the Device Packaging Conference 2007. At this year's conference, we will spotlight our thin and thick film offerings for wafer level packaging, WLP photoresist removers from EKC Technology, and Interra™ embedded passive materials. »More

 

February 19, 2007Picking Up the Latest Trend in Cell Phones DuPont Electronic Technologies (ET) in Research Triangle Park, NC recently hosted The International Wireless Industry Consortium, as part of an interactive technical workshop on handset technologies for multi-mode, multi-band cell phone antenna designs, sponsored by Sony Ericsson. »More

 

November 11, 2005 MEPTEC Article: DuPont Semiconductor Packaging & Circuit Materials – Connected by Science Drawing on the company’s broad science capabilities and long established positions in both semiconductor fabrication and circuit materials, DuPont Semiconductor Packaging and Circuit Materials (DSPCM) is taking a unique approach, and developing a portfolio of new processing and permanent materials for producing high reliability chip scale, flip chip, and wafer level packages and MEMS. »More

 

July 22, 2005 DuPont Electronic Technologies and Sanmina-SCI Sign Licensing Agreement for DuPont™ Interra™ Embedded Passive Materials Use in Buried Capacitance® Technology DuPont™ Interra™ HK polyimide laminates can now be used in the practice of Buried Capacitance® technology, available to Sanmina-SCI's existing family of licensed printed circuit board (PCB) manufacturers. » More