April 30, 2008 Interra™ Will Co-host Embedded Technology Seminar At the seminar, Dr. Jun Kim, Applications Development Specialist, will present "DuPont Embedded Capacitor Solutions: Driving miniaturization, cost reduction and improved electrical performance in a range of digital and wireless applications". »More
March 18, 2008 DuPont Technical Paper Wins Award at ECWC 11 in Shanghai Dr. Karl H. Dietz, Technology Manager, DuPont Electronic Technologies presented "Integration of Embedded Capacitors into Flip-chip Substrate Structures for Improved Power System Noise Decoupling and Charge Supply to the IC" at ECWC. »More
March 19, 2007 DuPont To Present Technical Papers at 2007 Device Packaging Conference DuPont Electronic Technologies is pleased to announce that we will once again be participating in the Device Packaging Conference 2007. At this year's conference, we will spotlight our thin and thick film offerings for wafer level packaging, WLP photoresist removers from EKC Technology, and Interra™ embedded passive materials. »More
February 19, 2007 Picking Up the Latest Trend in Cell Phones DuPont Electronic Technologies (ET) in Research Triangle Park, NC recently hosted The International Wireless Industry Consortium, as part of an interactive technical workshop on handset technologies for multi-mode, multi-band cell phone antenna designs, sponsored by Sony Ericsson. »More
November 11, 2005 MEPTEC Article: DuPont Semiconductor Packaging & Circuit Materials – Connected by Science Drawing on the company’s broad science capabilities and long established positions in both semiconductor fabrication and circuit materials, DuPont Semiconductor Packaging and Circuit Materials (DSPCM) is taking a unique approach, and developing a portfolio of new processing and permanent materials for producing high reliability chip scale, flip chip, and wafer level packages and MEMS. »More
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