The miracles of science™

Select Industry
Interra™ Home
Products
Interra™ Embedded Planar Capacitor Laminate Materials Interra™ Embedded Discrete Capacitor Materials Interra™ Embedded Discrete Resistor Materials
Sales & Support
News & Events
Technical Info
CONTACT US
Printer Friendly Version
DuPont Products & Services
DuPont Brands & Trademarks

Interra™ Embedded Passive Materials
Product Comparison Guide

Product
 Interra™ HK 04 – Planar Embedded Capacitor Laminate Material
 Interra™ Discrete
Embedded
Capacitor Material
 Interra™ Discrete
Embedded
Resistor Material
Key Technical Features
  • Unfilled polyimide copper clad Laminate
  • Dielectric thickness =
    - 25 micron (1 mil),
    - 18 micron (0.7 mil),
    - 12 micron (0.5 mil)
  • Gen I: Capacitance Density = 200 nF/cm-sq; Capacitance value that can be embedded: 0.5 – 20 nF
  • Gen II: Capacitance Density: > 1 µF/cm-sq
  • Resistor values: 10 – 10 k W
Commercialization Status
  • 25 micron and 18 micron version: commercial
  • 12 micron: under development
  • Gen I: beta-testing
  • Gen II: under development
  • Beta-testing
Applications High Speed Digital PWBs
  • Reduce simultaneous switching noise (SSN), lowering jitter and improved Eye-Openings
  • Reduce EMI radiation from the edge of the board
  • Reduce board thickness or increase Cu thickness or add additional signal layers
  • Replace surface mount capacitors, saving cost and board size
 Flip-Chip Packages
  • Reduce power supply noise by bringing the decoupling capacitors closer to the silicon die

RF Modules & Handheld/Cellphone motherboards
  • Reduce module or board size
  • Save cost by replacing surface mount capacitors
 High Speed Digital PWBs
  • Termination for transmission lines lowers inductance and eliminates parasitics associated with surface mount resistors

Memory (DRAM) Modules & Handheld/Cellphone motherboards
  • Reduce module or board size
  • Save cost by replacing surface mount resistors