Product
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Interra™ HK 04 – Thin Planar Embedded Capacitor Laminate
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Pyralux® APR
Embedded Capacitor-Resistor Laminate
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| Key Technical Features |
- Unfilled polyimide copper clad laminate
- Dielectric thickness =
- 25 micron (1 mil),
- 18 micron (0.7 mil),
- 12 micron (0.5 mil)
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- Laminate resistor values: 25, 50, 100 and 250 W/ square Cu foils with pure polyimide dielectric
- Combines the highest reliability resistor and dielectric materials
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| Commercialization Status |
- 12, 18, 24 micron dielectric versions commercial; many copper choices; tough, high yield, homogenous polyimide
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- Commercially available in a variety of dielectric thicknesses and W/ square copper foils
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| Applications |
High Speed Digital PWBs (Telecom, Server, Mil-Aero)
- Replace surface mount bypass capacitors (their PTHs and costs), saving cost and board size
- Improve signal routing, especially in critical areas, lower PCB layer count
- Reduce simultaneous switching noise (SSN), lowering jitter and improved eye-openings
- Reduce EMI radiation from the edge of the board
- Reduce board thickness or increase Cu thickness for better power handling
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Military, Aerospace and Microwave
- Increased toughness and reliability with smaller, lighter PCBs
- SMT resistor replacement in Rigid and Rigid Flex designs
Memory (DRAM) Modules & Handheld/Cellphone motherboards
- Reduce module or board size
- Save cost by replacing surface mount resistors
High Speed Digital PWBs
- Termination for transmission lines lowers inductance and eliminates parasitics associated with surface mount resistors
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