DuPont™ Interra™ embedded planar capacitor laminate is used to make thinner, more efficient power and ground planes within a multilayer printed wiring board. It provides very low impedance at high frequency, power bus decoupling, and electromagnetic interference reduction. HK04 saves PCB cost by replacing SMT by-pass capacitors, their PTHs and associated costs.
Interra™ HK 04 is a rugged polyimide dielectric laminate that can be processed like thin flexible circuit laminate through the develop/etch/strip process steps. The HK 04 dielectric is flexible and can be imaged and etched to remove copper on both sides of the dielectric at the same time. HK 04 provides high reliability through PCB processing and in extreme PCB conditions (eg. the Mars Rover).