DuPont™ Interra™ embedded planar capacitor laminate is used to make power and ground planes within a multilayer printed wiring board. It is ideal for low impedance at high frequency, power bus decoupling, electromagnetic interference reduction, and replacing by-pass capacitors currently served by discrete SMT components.
Interra™ HK 04 is a polyimide dielectric laminate that can be processed like thin flexible circuit laminate through the develop/etch/strip process steps. The HK 04 dielectric is flexible and can be imaged and etched to remove copper on both sides of the dielectric at the same time. HK 04 continues to provide high reliability in extreme conditions for the Mars Rover, still in operation after more than 3 years on the Mars surface.
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