Technical Info

Interra™ Product Comparison Guide

Interra™ HK 04 Embedded Planar Capacitor Laminate

• Key Features
• Interra™ HK 04 Data Sheet
• Interra™ HK 04 Design Guide

Interra™ Embedded Discrete Capacitor Materials

• Interra™ EP101 Fiducal Paste
• Interra™ EP310 Capacitor Dielectric Composition 
• Interra™ EP320 Copper Composition

Pyralux® APR Copper Clad Resistor Laminate

• Interra™ HK 04 Planar Capacitor Laminate Brochure

• PCB Power Delivery Optimizations for the Cost Driven Era 
• I/O Decoupling in High Speed Packages Using Embedded Planar Capacitors 
• Application of Embedded Capacitor Technology for High Performance Semiconductor Packaging
• What are Embedded Passives?
• Papers Presented at IPC 3rd International Conference on Embedded Technology

  • Decoupling of High Performance Semiconductors Using Embedded Capacitor Technology
  • Thick Film Polymer Resistors Embedded in Printed Circuit Boards
  • Embedded Ceramic Capacitors: The Road to Reliability

NOTE: One time registration required to access this literature.

Product Information

• Equivalent Circuit Model for HK 04 in HSPICE
• How can HK 04 save you $s in your PWB designs?
• PCB Cost Comparison: Interra™ HK 04 vs. FR-4
• Interra™ HK 04 Processing Guide
• Interra™ EP Processing Guide

Presentations

• DuPont Embedded Capacitor Materials: Driving miniaturization, cost reduction and improved electrical performance in a range of digital and wireless applications
• HK 04 vs. 2-mil F-4: Impact on Electrical Performance for Next-Generation High Speed Buses[.pdf]
• HK 04 Planar Capacitor Laminate for Next-Generation High Speed Designs [.pdf]