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DuPont™ Kapton® E is a premium performance polyimide film for use as a dielectric substrate for flexible printed circuits and high density interconnects. Kapton® E is the preferred dielectric film for very fine pitch circuitry due to its superior dimensional stability, lay-flat, high modulus, and a coefficient of thermal expansion match to copper. The excellent electrical characteristics and chemical etchability inherent to Kapton® HN and VN films have been maintained in Kapton® E polyimide film. Kapton® E film also has very low moisture absorption and is laser ablatable.

Applications

  • Flexible printed circuits
  • Fine pitch circuitry
  • Chip scale packaging
  • High density interconnects

Typical Properties of Kapton® E

Property 1 mil 1.5 mil  2 mil 
Tensile Modulus, kpsi 800 800 800
Moisture Absorption 1.8 1.8 1.8
CTE, ppm/°C 16 16  16
Dimensional Stability 0.05 0.05 0.05

For a complete listing of E properties, click here .