March 15, 2010 DuPont Circuit & Packaging Materials Opens New Technical Lab in China This multi-functional lab will enable faster and more efficient technical support for CPM customers in the electronics industry in China, and provide a facility for new product development and process evaluation. »More
February 26, 2010 DuPont Exhibits at CPCA 2010 Shanghai, China DuPont will be featuring its broad offering of technologies for the Printed Circuit Board (PCB) industry at CPCA 2010 in Shanghai, China, March 16 - 18, 2010. »More
January 7, 2010 DuPont™ CooLam™ Featured at Strategies in Light February 10 - 12, 2010 DuPont will highlight CooLam™ thermal substrates for metal core printed circuit boards at Strategies in Light, the longest running and largest high brightness light emitting diode (LED) and lighting conference and exhibition.
