CooLam™ thermal substrates are used in submount, chip-on-board and metal core PCB LED packaging applications.These thermal clad laminates are a composite of metal foil, proprietary polyimide dielectric with thermally conductive inorganic fillers bonded to a metal base, and provide an ideal insulated metal substrate for high brightness LED lighting.
Key properties of DuPont™ CooLam™ thermal substrates:
- Low thermal resistance allows more light output at the same current
- Fewer LEDs achieve the same level of light intensity
- LEDs run cooler and longer
Features Include:
- Very low thermal impedance
- Excellent durability and stability at high temperature
- UL 94 recognition: V-0
- Halogen free
- Lead free solder compatibility
- RoHS compliant
Applications Include:
Contact us for more information on DuPont™ CooLam™ thermal substrates.
