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TOM Substrate - Thick film On Metal

DuPont provides a complete ceramic solution for High Brightness LED packaging, including thick film materials for the substrate and chip package.

We can accommodate both prototype and high volume requests. All materials are lead-free and RoHS compliant. Inorganic (ceramic) solutions will meet the needs for high end HB-LED packages which require improved thermal dissipation and/or higher reliability over FR-4 solutions within demanding niche applications.

Material Comparison

Materials Thermal Conductivity
[W · m-1 · K-1]
Density
[g/cm3]
TCE
[10-6K-1]
Aluminum alloy 230 2.7 23
Stainless steel 25 7.7 10
Glass epoxy 0.6 1.9 13

For more information on DuPont Microcircuit Materials contact DuPont.