NASA Tech Brief’s Lighting Technology Magazine recently published an article titled, “How Substrate Materials Affect LED Reliability”, in which DuPont™ CooLam® thermal substrates were featured. The article highlights the need for packaging and thermal substrate technologies that deliver better thermal management, are more reliable and cost-efficient, and focuses on the role of thermal substrates such as Metal Core Printed Circuit Boards (MCPCBs) to optimize LED performance. The benefits of replacing FR-4 boards or thermally conductive epoxies with metal-core laminate boards (MCBs) were addressed as well as how polyimide materials and their unique properties, including reliability, thinness, robustness, and bendability are being leveraged for broader designs and applications in LED lighting.
New materials are enabling 3D LED designs. Shown here is a sample of DuPont™ CooLam® 3D thermal substrate used in an A19 replacement bulb design concept.
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Contact UsFor more information on how DuPont™ CooLam® thermal substrates can yield longer life, more output and better light quality to reduce overall costs, please visit our CooLam® product page or contact us.