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Chip on Board

High watt LED die benefit from a direct MCPCB thermal path. Let us consult with you on your thermal needs and suggest a cost effective solution.

Organic Substrates

CooLam® LX thermal substrates A composite of metal foil, proprietary polyimide dielectric with thermally conductive inorganic fillers bonded to a metal base.

Chip on board - Assemble Bare die Directly to MCPCB