Thermal management requirements for high brightness LEDs require a very low thermal resistance system. MCPCBs are a standard building block of high brightness applications requiring thermal management. We offer cost effective one of a kind custom solutions tailored to your thermal requirements.
CooLam® LX thermal substrates A composite of metal foil, proprietary polyimide dielectric with thermally conductive inorganic fillers bonded to a metal base.
Microcircuit Materials Solutions for high brightness LED packaging based on Thick film On Metal (TOM) for both the substrate and chip package.