LED die packages come in many form factors. Low cost and low thermal resistance are just two of many design criteria. To meet your most demanding thermal requirements, please view our high volume solutions below.
CooLam® LX thermal substrates A composite of metal foil, proprietary polyimide dielectric with thermally conductive inorganic fillers bonded to a metal base.
Microcircuit Materials Solutions for high brightness LED packaging based on DuPont™ GreenTape™ Low Temperature Co-fired Ceramic (LTCC) materials for both the substrate and chip package.