BGA Using Integrated Components with Green Tape™ Makes Cell Phones Smaller and Lighter
Challenge: Decreased Size and Cost, Improved Performance for Wireless Devices
Portable wireless applications have quickly become the main driver for smaller, more cost-effective packaging and interconnects. For example, in the last few years, cell phones have evolved into lightweight, palm-size devices with a host of new functions. Their weight has decreased by a factor of 10, and the wholesale selling price by 75 percent.
OEM designers are now learning that integrating IC and package design to take advantage of the unique properties of Low Temperature Co-fired Ceramic (LTCC) technology can yield decreased size and improved performance in wireless devices.
National Semiconductor is a leader in applying the LTCC advantages of high-density interconnect capability, ability to integrate passive components, and low-loss performance. In a recent design, National chose to combine its advanced ICs for wireless communications with Green Tape™, DuPont's brand of LTCC tape dielectric material, to provide optimum performance in the smallest possible package.
Solution: Green Tape™ LTCC Allows for High I/O Counts in Chip Scale Package
National's newest chipsets use Green Tape™ packaging capabilities to provide a chip scale package that can accommodate the high I/O counts of a highly integrated RF analog front end using micro BGA (ball grid array) technology. The current package, only 9 x 9 mm, can provide 81 I/Os in a micro BGA array, plus topside pads for wirebonding that interconnects to the BGA pads on the back side. The high number of I/Os allows for multiple grounds to improve RF performance, while the embedded multilayer structure contains 14 RF bypass capacitors constructed using a combination of high-K and low-K dielectrics.
The performance of the frequency synthesizer function can be enhanced through the use of an embedded VCO resonator that provides a high Q, and therefore lower phase noise, than that available using a VCO resonator located on the silicon.
This approach, co-designing the silicon and LTCC elements to achieve optimized size and performance, demonstrates the use of co-integration for wireless applications requiring smaller package size and higher performance at the lowest possible cost.
For more information, call DuPont at 1-800-284-3382, press 3.