DuPont to Participate in 2004 Conference on Ceramic Interconnect Technology With Technical Presentations on LTCC and Lead Free Technologies
DuPont Microcircuit Materials will participate in several technical presentations on Low Temperature Co-fired Ceramic (LTCC) thermal performance and LTCC lead free technologies at the 2004 Conference on Ceramic Interconnect Technology in Denver, Colorado. The electronics conference and exhibit sponsored by IMAPS will take place April 26 - 28, 2004, at the Hyatt Regency Denver.
"Lead Free LTCC System for Automotive and Telecommunication Applications" will be presented in Session WP3: LTCC Systems and Processing by Yong S. Cho, DuPont senior research chemist. The paper introduces a new developmental lead-free LTCC system designed for automotive and telecommunication applications. Performance and integrity of silver-based conductors, compatible with the new LTCC system, will be discussed. Particular emphasis is placed on high frequency electrical characteristics and firing behavior of the new lead-free LTCC system.
Daniel I. Amey, DuPont research fellow, will present "Thermal Performance of DuPont 943 Low Loss Green Tape™ LTCC with Thermal Via and Internal Metallization Enhancements" in Session TP3: Power and Thermal Management. Stability and uniform electrical properties, over broad frequency and operating temperature ranges, are critical in wireless communication applications. This paper discusses the thermal test program, measurement method, and thermal conductivity results in testing of 943 Low Loss Green Tape™ materials. Considerations for thermal design based on varying the number of vias, via size, and metallization layers will be discussed. MiMi Keating of DuPont Central Research & Development is a co-author of this paper.
"Improvements in the Thermal-Cycled Adhesion of Soldered Conductors on LTCC Substrates" will be presented in Session TP2: Advanced Assembly Topics by Patricia J. Ollivier, DuPont research chemist. The thermal expansion mismatch between LTCC tape dielectrics and conductors makes it difficult to meet thermal cycle and aging specifications required by the automotive industry. Alternative organic adhesives for simple components and wire bonding for IC connections are not capable of providing a universal "no-solder" solution. This paper focuses on development and performance of new solderable conductor technology to deliver superior thermal-aged and thermal-cycled adhesion.
"Performance of Buried and Surface Resistors in DuPont™ 943 Low Loss Green Tape™ System" will be presented in Session WA2: Integrated Passives in LTCC by Mike F. Barker, DuPont senior research chemist. LTCC materials enable high frequency circuits for automotive applications (24Ghz, 77GHz), telecommunications modules (28-38GHz), and high reliability military and aerospace applications. A particular benefit of LTCC is the ability to bury components, such as resistors, for power dividers, terminations, couplers, filters and other functions in high frequency circuits. This paper discusses buried and surface resistor compositions compatible with the DuPont™ 943 Low Loss Green Tape™ system. Processing, modeling, simulation, and testing of high frequency performance are discussed for a range of design configurations.
DuPont contributed to the keynote presentation "Sensors, Actuators and other Non-Packaging Applications of LTCC Tapes." This joint paper with the University of Pennsylvania uses the DuPont™ 951 Green Tape™ material system. DuPont also collaborated with the University of Minnesota on the joint paper "Design Considerations for Uniplanar Test Structures for High Frequency Material Characterization" to be presented in Session WP2: Design and Measurement.
DuPont Microcircuit Materials has over 35 years of experience in the development, manufacture, sale, and support of specialized thick film compositions and Green Tape™ materials for a wide variety of electronic applications in the automotive, biomedical, industrial, military, and telecommunications markets. For more information about DuPont Low Temperature Co-fired Ceramic (LTCC) Green Tape™ technology and thick film compositions for ceramic substrates, contact DuPont Microcircuit Materials at 1-800-557-4505 or visit www.dupont.com/mcm.
DuPont is a science company. Founded in 1802, DuPont puts science to work by solving problems and creating solutions that make people's lives better, safer and easier. Operating in more than 70 countries, the company offers a wide range of products and services to markets including agriculture, nutrition, electronics, communications, safety and protection, home and construction, transportation and apparel.
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