DuPont Microcircuit Materials Introduces DuPont™ Solamet® Lead-Free Metallization System for Solar Cells
DuPont Microcircuit Materials (MCM) today announced the launch of a new lead-free addition to the DuPont™ Solamet® family of thick film pastes designed for the metallization of solar cells. A new frontside silver composition, a new low bow lead free backside aluminum paste and lead free tabbing silver, together makeup the new DuPont™ Solamet® lead free metallization system. DuPont will present this new offering, along with its broad portfolio of integrated materials and technologies for the photovoltaic (PV) industry, at the 20th European Photovoltaic Solar Energy Conference and Exhibition, Barcelona 6-10th June 2005, stand 77.
"MCM is putting science to work and moving fast to develop new materials for our customers in the photovoltaic industry," said Peter Brenner, global segment manager - photovoltaics, DuPont Microcircuit Materials. It's a key growth segment where our customers who develop solar cells have challenging technical requirements that we can help them meet. The new Solamet® lead free metalization system is not only environmentally friendlier, it offers exceptional electrical performance and greater reliability. We are pleased to offer the Solamet® lead free system. It's a winning combination for a more sustainable future."
The new cadmium and lead free frontside silver composition, DuPont™ Solamet® PV17x series, has electrical properties similar to the market leading PV14x series, and the recently launched PV15x cadmium free series, which is specifically aimed at processes that use shallow emitters (45-60 ohms) and use lead free soldering for the tabbing process. DuPont™ Solamet® frontside silver compositions also have the same fine line capability that was designed into the PV15x and specialist fine line PV14x materials.
The new low bow, lead-free Aluminium compositions proved in testing they outperform competitive compositions for both bowing and electrical performance, and in subsequent tests, proved to outperform competitive compositions for bowing on 180 micron cells. Lead free silver tabbing materials PV583 and PV581 have been available to the market for several months, and a new lead free Silver/Aluminium composition is in development as well.
The DuPont™ Solamet® Lead Free Metalization System includes:
- PV17x Lead free - frontside silver
- PV34x Lead free - aluminium
- PV58x Lead free - tabbing silver
Other DuPont™ Solamet™ Materials include:
- PV14x Market leading frontside silver
- PV15x Cadmium free frontside silver
- PV16x Non-contact frontside silver
- PV32x Backside aluminium
- PV202 Backside and tabbing silver/aluminium
DuPont Microcircuit Materials also offers compositions for novel contact geometries and many silver or carbon polymer compositions.
DuPont Microcircuit Materials has over 40 years of experience in the development, manufacture, sale, and support of specialized thick film compositions for a wide variety of electronic applications in the photovoltaic, automotive, biomedical, industrial, military, and telecommunications markets. For more information about the DuPont™ Solamet™ lead free metallization system, contact DuPont Microcircuit Materials at 1-800-557-4505 or visit www.dupont.com/mcm. Microcircuit Materials is part of DuPont Electronic Technologies, a leading supplier of electronic materials, including materials for the fabrication and packaging of semiconductors, materials for rigid and flexible circuits, and materials for advanced displays. For further information, please visit www.dupont.com/et.
DuPont is a science company. Founded in 1802, DuPont puts science to work by creating sustainable solutions essential to a better, safer, healthier life for people everywhere. Operating in more than 70 countries, DuPont offers a wide range of innovative products and services for markets including agriculture, nutrition, electronics, communications, safety and protection, home and construction, transportation and apparel.
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