DuPont Microcircuit Materials Introduces New Lead-Free Fodel® for Plasma Display Panels
DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, introduces lead-free DuPont™ Fodel® photoimageable thick-film paste for the metallization of the front bus electrode used in plasma display panels (PDPs). The new lead-free DuPont™ Fodel® photoimageable thick-film paste enables compliance with lead-free directives, while providing the same cost effective, high performance metallization for PDPs provided by previous generation products. DuPont will present this new offering, along with a broad portfolio of display materials, at the Society for Information Display (SID) Symposium in San Francisco, Calif., from June 5-9, at booth #805.
"The PDP market is growing at double digit annual rates that are projected to continue consistent with strong demand for large size TVs in the next several years, and we expect all major PDP manufacturers will continue to expand significantly," said Walt Cheng, global business director, DuPont Microcircuit Materials. "Higher quality materials, consistent supply, lower cost-in-use, and more environmentally sustainable materials are increasingly needed by PDP manufacturers. We believe that this and future developments in Fodel® technology will enable manufacturers to continue to meet these stringent requirements for quality and cost."
As the leading global supplier of thick-film conductive pastes, DuPont has been developing pastes and materials technologies for PDPs in cooperation with major PDP manufacturers for over 15 years. DuPont™ Fodel® photoimageable thick-film paste technology provides a simple, high yield and highly scaleable process for fine-line patterning of conductor lines on plasma glass panels. The PDP front-side glass's electrode bus system is composed of silver electrode paste and black paste cofired together in a two-layer structure. DuPont developed the industry standard two-layer bus system design with its innovative black paste, leveraging proprietary materials technology from the chip resistor industry. DuPont thick-film pastes are used by most major PDP manufacturers today.
The new DuPont™ Fodel® photoimageable thick-film paste is an advanced fully-lead-free material which also enables fine-line resolution, thin prints for low paste usage, wide processing margins, and high quality. The innovative black paste system utilizes DuPont patented lead-free ruthenium pyrochlore material and patented lead-free glasses, giving industry-leading properties including the critical balance between blackness and resistivity that is essential to high image quality from plasma TVs.
Lead-free DuPont™ Fodel® photoimageable thick-film pastes are a prime example of how DuPont Microcircuit Materials is emerging as a market leader in developing technologies that reduce the environmental impact of electronics.
DuPont Microcircuit Materials has over 40 years of experience in the development, manufacture, sale, and support of specialized thick film compositions for a wide variety of electronic applications in the display, photovoltaic, automotive, biomedical, industrial, military, and telecommunications markets. For more information about DuPont™ Fodel® photoimageable thick-film pastes, contact DuPont Microcircuit Materials at 1-800-284-3382 or visit mcm.dupont.com . Microcircuit Materials is part of DuPont Electronic Technologies, a leading supplier of electronic materials, including materials for the fabrication and packaging of semiconductors, materials for hybrid, rigid and flexible circuits, and materials for advanced displays.
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