DuPont Microcircuit Materials (http://mcm.dupont.com) will showcase its extensive range of products for the manufacture of high performance, high reliability circuits for automotive applications at SMT/HYBRID/PACKAGING 2008 in Nuremberg, 3-5 June 2008, at booth number 9 - 347.
As a leading supplier of thick film pastes and materials to the global automotive industry, DuPont MCM continues to work on new product development for specific automotive applications at its R&D centres in Europe, Japan and USA. Products include a full range of thick film hybrid products for the manufacture of ceramic-based circuits, electronic components and high frequency applications such as conductors, resistors, dielectrics, LTCC tape, overglazes and a full range of polymeric products for automotive applications.
“The global market for automotive electronics continues to grow rapidly, driven by active safety and environmental applications. Europe, in particular, is a key region due to the strength of European OEMs and their 1st tier suppliers,” says Eric McLean, the European Automotive Segment Manager for DuPont MCM. “DuPont MCM is well positioned to offer innovative solutions to our automotive customers both in terms of existing product systems and through focussed product development programmes. We recognise that product performance, cost effectiveness and high reliability are key to the automotive market and will continue to meet these requirements through ongoing development of our products, processes and systems.”
DuPont Microcircuit Materials has over 40 years of experience in the development, manufacture, sale, and support of specialised thick film compositions for a wide variety of electronic applications in the display, photovoltaic, automotive, biomedical, industrial, military, and telecommunications markets. For more information on DuPont Microcircuit Materials, visit mcm.dupont.com. Microcircuit Materials is part of DuPont Electronic Technologies, a leading supplier of electronic materials, including materials for the fabrication and packaging of semiconductors, materials for hybrid, rigid and flexible circuits, and materials for advanced displays.
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