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DuPont Microcircuit Materials

News & Events Archive - 2005, 2004


September 26, 2005


DuPont Microcircuit Materials Paves the Way to Lead-Free With New System LF Thick Film Compositions DuPont Microcircuit Materials (MCM) today announced the U.S. launch of System LF, a series of thick film paste compositions for the production of lead-free hybrid circuitry.

July 22, 2005


DuPont Electronic Technologies and Sanmina-SCI Sign Licensing Agreement for DuPont™ Interra™ Embedded Passive Materials Use in Buried Capacitance® Technology DuPont Electronic Technologies today announced an agreement with Sanmina-SCI to become a licensee of Sanmina-SCI's patented Buried Capacitance® technology. DuPont™ Interra™ HK polyimide laminates can now be used in the practice of Buried Capacitance® technology...

June 14, 2005


DuPont Microcircuit Materials Introduces New DuPont™ Green Tape™ Low Loss Materials for High Frequency Military Radar and Automotive Safety Systems DuPont Microcircuit Materials (MCM) today announced the introduction of two new DuPont™ Green Tape ™ low temperature, co-fired ceramic (LTCC) material systems - 943 KX and 943 PX - for low loss, high frequency applications.

June 07, 2005

DuPont Microcircuit Materials Introduces DuPont™ Solamet® Lead-Free Metallization System for Solar Cells DuPont Microcircuit Materials (MCM) today announced the launch of a new lead-free addition to the DuPont™ Solamet® family of thick film pastes designed for the metallization of solar cells.



March 11, 2004
DuPont to Participate in 2004 Conference on Ceramic Interconnect Technology With Technical Presentations on LTCC and Lead Free Technologies

DuPont Microcircuit Materials will participate in several technical presentations on Low Temperature Co-fired Ceramic (LTCC) thermal performance and LTCC lead free technologies at the 2004 Conference on Ceramic Interconnect Technology in Denver, Colorado.


March 01, 2004
DuPont Enhances Membrane Switch Reliability with New Silver Migration-Resistant Polymer Thick Film (PTF) 

Conductive Compositions DuPont Microcircuit Materials announces two new screen-printable, silver-based polymer thick film (PTF) conductive compositions developed for the appliance industry that significantly reduce silver migration and increase circuit life and reliability.


DuPont Media Relations Representative

Media interviews and additional information can be obtained by contacting:
Ellen G. Pressley
Public Relations Representative
14 TW Alexander Drive
RTP, NC 27709