DuPont Microcircuit Materials will participate in several technical presentations on Low Temperature Co-fired Ceramic (LTCC) thermal performance and LTCC lead free technologies at the 2004 Conference on Ceramic Interconnect Technology in Denver, Colorado.
Conductive Compositions DuPont Microcircuit Materials announces two new screen-printable, silver-based polymer thick film (PTF) conductive compositions developed for the appliance industry that significantly reduce silver migration and increase circuit life and reliability.
DuPont Media Relations Representative
Media interviews and additional information can be obtained by contacting: Ellen G. Pressley
Public Relations Representative
14 TW Alexander Drive
RTP, NC 27709