2009
October 28, 2009
DuPont Microcircuit Materials Introduces GreenTape™ 9K7 LTCC
DuPont Microcircuit Materials (MCM) today announced the introduction of the DuPont™ GreenTape™ 9K7 low temperature co-fired ceramic (LTCC) material system, designed for advanced high-frequency, microwave, and millimetre wave electronic circuit applications within the aerospace, automotive, military, consumer electronics, and telecommunications industries. » More
September 18, 2009
DuPont and Applied Materials Collaborate to Boost Solar Cell Efficiency
DuPont and Applied Materials, Inc. announced a collaboration to advance multiple printing technology that is expected to increase the absolute efficiency of crystalline silicon (c-Si) photovoltaic (PV) solar cells. By increasing the efficiency and yield of solar cells and modules, PV power can become more cost effective versus other forms of energy. » More
September 17, 2009
DuPont Microcircuit Materials Introduces Solamet® PV173 Photovoltaic Metallization Paste
DuPont Microcircuit Materials today announced the introduction of DuPont™ Solamet® PV173 photovoltaic (PV) metallization paste, a new lead-free* front side material for crystalline silicon solar cells. With its high performance and superior environmental properties, Solamet® PV173 is targeted to PV cell and module manufacturers who are seeking technologies with a significantly reduced environmental footprint.
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September 8, 2009
DuPont Introduces New Solamet® PV412 Photovoltaic Metallization for Thin Film Solar Technologies
DuPont™ Solamet® PV412 photovoltaic (PV) metallization paste, is the latest in a line of silver conductor materials specifically developed for thin film PV technologies. Thin film PV is projected to be the fastest growing segment of the solar module industry primarily because of its potential to reduce the cost of producing solar-derived energy. » More
July 23, 2009
DuPont to deliver paper on new GreenTape™ LTCC system at IMAPS
A representative of DuPont Microcircuit Materials will present a technical paper on the characterization of an all new DuPont™ GreenTape™ low temperature co-fired ceramic materials system for RF/Microwave packaging applications. » More
July 22, 2009
DuPont MCM to exhibit at Plastic Electronics Europe, 2009
DuPont Microcircuit Materials will exhibit its broad and growing portfolio of customizable, functional inks for both thin-film photovoltaic and printed electronics at the Plastic Electronics Europe, 2009 Conference and Exhibition. » More
June 8, 2009
MCM delivers technical topic at IEEE Photovoltaic Specialists Conference
DuPont Microcircuit Materials representatives today delivered a technical presentation to the photovoltaic industry during the 34th IEEE Photovoltaic Specialists Conference. » More
March 25, 2009
DuPont Microcircuit Materials Presents Research Findings on New Technologies for Photovoltaic Thin Films
Thin film photovoltaics is a key emerging market that we expect will reach up to 1.5 gigawatts in 2009, with an increasing share of flexible and rigid designs utilizing front side metallization inks such as Solamet® PV410 metallization. » More
March 11, 2009
DuPont MCM Featured at Dresden IDTechEx Printed Electronic & Photovoltaic Conference and Exhibitions
DuPont MCM is exhibiting its broad portfolio of customizable, functional inks for both thin-film PV and Printed Electronics. A technical presentation on "Advanced Screen Printable Thin Film PV Front-Side Silver Conductor Compositions" will also be given. » More
March 5, 2009
DuPont Microcircuit Materials and CAD Design Software Integrate LTCC Materials and Processes in CDS Ceramic Design Software to Speed Design
In order to significantly improve cycle time for advanced circuit design, DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, and CAD Design Software have announced the integration of DuPont™ GreenTape™ low temperature co-fired ceramic (LTCC) materials and manufacturing processes into CAD Design Software’s Electronic Design Automation (EDA) design tools for Ceramic (Hybrid/MCM – LTCC) circuit design. » More
February 25, 2009
DuPont Microcircuit Materials Doubles Manufacturing Capacity for DuPont™ Solamet® Metallization Pastes
DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, has announced it recently doubled production capacity and made key quality improvements at its European Electronic Materials Manufacturing Facility in Bristol, U.K. » More
2008
November 19, 2008
DuPont Microcircuit Materials Introduces New Offering for Printed Electronics
Silver conductive ink designed as cost-effective solution for RFID antennae, biosensors, membrane touch switch applications and more.
» More
September 9, 2008
DuPont Microcircuit Materials Features Enabling Technologies at the FISITA World Automotive Conference
DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, will exhibit the latest innovations in automotive electronic ceramic circuits using DuPont thick film compositions at the FISITA World Automotive Conference. » Deutsch
July 31, 2008
DuPont Microcircuit Materials Introduces New Solamet® PV159 for Photovoltaic Solar Cells
This new, advanced material has outperformed competitive metallization pastes in a wide range of processes, and in trials by customers around the world.
June 19, 2008
DuPont Microcircuit Materials Opens New Photovoltaic Technical Center
The center provides research, development and technical support for its customers in the photovoltaic (PV) solar energy industry that use DuPont™ Solamet® thick film metallization pastes.
June 11, 2008
DuPont Electronic Technologies Announces Global Price Increase
DuPont Electronic Technologies cites rising raw material, transportation and energy costs among its reasons for the increase.
June 9, 2008
DuPont Expands Production of Solamet® Photovoltaic Metallization Paste System for Fast Growing Solar Energy Market
To meet the needs of the fast-growing photovoltaic (PV) solar energy market, DuPont today announced that it will expand production of DuPont™ Solamet® thick film metallization pastes at its Electronic Materials DuPont Dongguan Ltd. (EMDD) facility here.
May 27, 2008
DuPont Microcircuit Materials Showcases full range of Innovative Materials for Automotive Electronics at SMT 2008
Products include a full range of thick film hybrid products for the manufacture of ceramic-based circuits, electronic components and high frequency applications such as conductors, resistors, dielectrics, LTCC tape, overglazes and a full range of polymeric products for automotive applications.
May 2, 2008
DuPont to Feature Material Offerings at ECTC 2008
DuPont Electronic Technologies will display its expanding portfolio of laminates, thick films, photoresists and removers for semiconductor packaging at the Electronic Components and Technology Conference.
March 31, 2008
DuPont Microcircuit Materials Highlights New Developments at Printed Electronics Europe DuPont MCM is exhibiting its broad portfolio of customizable, functional inks at the show in stand number 25, where it will also introduce a new printed electronics brochure, titled "New Dimensions in Printed Electronics"
March 24, 2008
DuPont to Present at IDTech Expo 2008 DuPont Microcircuit Materials will participate in IDTech Expo 2008, Europe's largest printed electronics event. This year's show will be held on April 8-9, 2008 at the Martitim Hotel in Dresden, Germany.
January 29, 2008
Matsushita Electric Industrial Co. Adopts New DuPont™ Fodel® 8G Conductor System DuPont™ Fodel® 8G pastes are used in the metallization of the plasma display panel (PDP) front bus electrodes in order to improve image quality and achieve substantial cost savings through dramatically reduced precious metal content.
2006
December 11, 2006
AWR and DuPont Microcircuit Materials Deliver LTCC PDK for Microwave Office Design Suite Applied Wave Research, Inc. (AWR®) and DuPont Microcircuit Materials, part of DuPont Electronic Technologies, today announced the availability of a process design kit (PDK) that enables radio-frequency (RF), microwave, and millimeter wave designers to access the DuPont™GreenTape™ low temperature co-fired ceramic (LTCC) technology within AWR's Microwave Office® 2006 software.
November 20, 2006
DuPont Microcircuit Materials Celebrates 10 Year Anniversary at EMDD, Dongguan, China DuPont was the first multinational company to establish a production facility for thick film microcircuit materials in China. Since its start-up in 1996, EMDD has been serving the rapidly growing China domestic electronics market.
October 12, 2006
DuPont Microcircuit Materials Receives Service Award from Q-Cells Marking five years of successful collaboration, DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, today announced that it is the proud recipient of a Q-Cells Supplier Award for its provision of metallization materials used in the construction of silicon photovoltaic cells.
October 05, 2006
DuPont Microcircuit Materials Scientist Honored at IMAPS DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, today announced that Senior Scientist Roupen Keusseyan will be presented with the William D. Ashman Award by the International Microelectronics and Packaging Society (IMAPS).
May 24, 2006
DuPont Microcircuit Materials Introduces New Lead-Free Fodel® for Plasma Display Panels The new lead-free DuPont™ Fodel® photoimageable thick-film paste enables compliance with lead-free directives, while providing the same cost effective, high performance metallization for PDPs provided by previous generation products.
May 18, 2006
DuPont Announces Advanced Displays Technologies DuPont, a leading supplier of materials to the flat panel display industry, today announced a wide range of recent innovations that provide critical benefits for the performance of displays.
DuPont Media Relations Representative
Media interviews and additional information can be obtained by contacting:
Ellen G. Pressley
Public Relations Representative
919-248-5598
14 TW Alexander Drive
RTP, NC 27709
