2011
December 7, 2011
DuPont Electronic Materials Enable New Breakthrough in Hypothermia Prevention Gear from North American Rescue
DuPont Electronics & Communications (DuPont) and North American Rescue (NAR), a leading developer and supplier of life-saving gear, today announced the launch of a new line of battery-activated hypothermia prevention products focused on decreasing preventable death and improving patient outcomes through patient thermal management. » More
November 22, 2011
DuPont Microcircuit Materials Introduces New Silver Conductor for Printed Electronics
DuPont Microcircuit Materials (MCM) has introduced its latest screen printed silver conductor material for the printed electronics market. Utilizing proprietary technology and under typical processing conditions used for many printed electronic applications. » More
October 7, 2011
DuPont Microcircuit Materials Presents New Low Temperature Co-fired Ceramic Materials Developments at IMAPS 2011
DuPont™ GreenTape™ 9K5 low temperature co-fired ceramic (LTCC) material with superior dielectric constant properties, is designed for higher speed, higher frequency and higher reliability applications. DuPont also is presenting on methods of characterization for LTCC dielectrics in high frequency microwave and millimeter wave packaging. » More
September 7, 2011
DuPont Microcircuit Materials Introduces New Lower-Silver Solamet® Photovoltaic Metallization
DuPont has introduced DuPont™ Solamet® PV51M photovoltaic metallization paste, a new tabbing material used in solar cell manufacturing. This breakthrough formulation enables cell makers to use up to 15 percent less material, in line with the company’s intent to accelerate product developments that help the photovoltaic industry reduce its dependence on silver metals and offset some of the impact that rising silver prices have on the cost of producing solar cells and modules. » More
September 2, 2011
DuPont Files Patent Infringement Lawsuit against Heraeus
DuPont today filed a lawsuit against Heraeus Holding GmbH and Heraeus Materials Technology, LLC for allegedly infringing a DuPont patent related to its front-side metallization paste materials used in solar cell technology. » More
September 1, 2011
Leading Photovoltaic Module Manufacturers Adopt DuPont™ Solamet® Photovoltaic Metallizations for Higher Efficiency Solar Cells and Modules
Sunways AG and Heckert Solar AG added to a growing list of leading photovoltaic manufacturers using DuPont™ Solamet® PV17x to produce higher efficiency solar cells and modules. Since their introduction in February 2011, Solamet® PV17x has repeatedly proven to enable higher conversion efficiency, process reliability, yield and superior aesthetics. Because Solamet® PV17x series metallizations also enable 10 percent lower material consumption, they achieve results more cost effectively which translates into savings for cell and module manufacturers. » More
August 30, 2011
DuPont™ Solamet® PV414 Photovoltaic Metallization Enables Thin Film Modules from Flexcell
The new offering was recently qualified at Flexcell, a leading Swiss producer of flexible amorphous silicon thin film modules for building integrated photovoltaics (BIPV) and mobile solar chargers. Solamet® photovoltaic metallization pastes are key to higher efficiency and lower system costs for both crystalline silicon (c-Si) and thin film PV. » More
August 15, 2011
DuPont Microcircuit Materials Advances Printed Electronics Development Efforts by Employing NovaCentrix PulseForge® Tools
DuPont Microcircuit Materials (MCM), announced an arrangement with NovaCentrix regarding MCM’s use of NovaCentrix’s PulseForge® tools which MCM anticipates will further its development of state-of-the-art materials and processing technology, as DuPont continues to expand its portfolio of functional inks for the growing printed electronics industry. » More
July 25, 2011
DuPont Expands in Solar Energy with Acquisition of Innovalight
DuPont today announced that it has acquired Innovalight, Inc., a company specializing in advanced silicon inks and process technologies that increase the efficiency of crystalline silicon solar cells. The acquisition further strengthens DuPont's position as a clear leader in materials for the solar energy market. » More
June 9, 2011
DuPont™ Solamet® Photovoltaic Metallizations Enable Canadian Solar’s High-Efficiency Metal Wrap Through Solar Cells
DuPont™ Solamet® photovoltaic metallization pastes continue to advance critical solar cell technologies to enable more cost-effective, high-efficiency solar cell and module designs. The latest collaboration with Canadian Solar Inc. has resulted in Canadian Solar’s ELPS cells with 19.5 percent conversion efficiency for monocrystalline silicon (c-Si) solar cells using Metal Wrap Through (MWT) technology. » More
May 5, 2011
DuPont Microcircuit Materials Developments to Lead to New Lower-Silver Solamet® Photovoltaic Offering
DuPont Microcircuit Materials (MCM) is accelerating the completion of a breakthrough technology innovation that is enabling the company to develop formulations for a new series of its leading DuPont™ Solamet® brand photovoltaic (PV) metallization pastes that significantly reduce the silver content. » More
February 22, 2011
DuPont Launches New Generation Frontside Silver Photovoltaic Metallizations
DuPont Microcircuit Materials (MCM) is introducing a new series of frontside silver photovoltaic metallization pastes using new and novel chemistry formulated to deliver advanced efficiency and adhesion for solar cells. DuPont™ Solamet® PV17x series photovoltaic metallizations also will enable higher process reliability and yield for both cell and module manufacturers. » More
February 17, 2011
DuPontIntroduces New Solamet® Photovoltaic Metallization Pastes for Local Back Surface Field Solar Cell Designs
DuPont has introduced a new series of aluminum photovoltaic metallization pastes for rear side passivated crystalline silicon solar cell designs. DuPont™ Solamet® PV36x photovoltaic metallization pastes outperform conventional aluminum compositions by delivering up to 0.8 percent greater conversion efficiency for solar cells when used in Local Back Surface Field (BSF) designs. » More
February 16, 2011
DuPont Introduces New Solamet® Photovoltaic Metallization for Metal Wrap Through Solar Cell Designs
DuPont Microcircuit Materials (MCM) has introduced Solamet® PV701 photovoltaic metallization paste as its newest generation of Metal Wrap Through (MWT) technology for back side interconnected silicon solar cell designs.» More
February 15, 2011
DuPont Microcircuit Materials Expands Printed Electronics Research with Holst Centre Collaboration
The collaboration is expected to advance technology specifically in the area of printed structures on flexible substrates, which has application in flexible display, RFID, lighting, biomedical and Organic Photovoltaic (OPV) markets. » More
2010
December 1, 2010
DuPont Showcases Innovative Offerings for Printed Electronics
DuPont Microcircuit Materials (MCM) is highlighting two conductive inks for use in flexographic and gravure processes used to produce printed electronics such as Radio Frequency Identification (RFID) tags, smart packaging, sensors, displays, and solid state lighting » More
November 2, 2010
DuPont Microcircuit Materials Exhibited at 43rd International Symposium on Microelectronics
MCM exhibited its broad and growing portfolio of specialized thick film compositions for a wide variety of electronic applications in the photovoltaic, display, automotive, biomedical, industrial, military, and telecommunications markets. » More
September 6, 2010
New Solamet® Materials and Innovative Process Technologies to Enable Future Growth in Photovoltaics
Roadmap of proposed technology options to help enable the industry goal for conversion efficiency of crystalline silicon (c-Si) solar cells beyond 20 percent by 2012. » More
DuPont to Double Solamet® Production to Meet Surging Solar Energy Market Demand
As part of DuPont’s efforts to help reduce the world’s dependence on fossil fuels, the capacity increase is consistent with the company’s expectation that its sales of enabling innovations into photovoltaic applications will exceed $1 billion in 2011 and $2 billion by 2014. » More
June 23, 2010
DuPont Photovoltaic Solutions will exhibit at the 25th European Photovoltaic Solar Energy Conference and Exhibition
DuPont Photovoltaic Solutions will be showcasing its broad and growing portfolio of innovative material technologies for the solar energy industry with a feature exhibition and participation in several key technical forums. » More
June 23, 2010
DuPont Photovoltaic Solutions will Exhibit at Intersolar North America
DuPont Photovoltaic Solutions will exhibit new PV products to increase solar cell efficiency for crystalline silicon and thin film photovoltaics.
» More
June 17, 2010
DuPont Microcircuit Materials Introduces New High Efficiency Solamet® Photovoltaic Metallization Pastes
This advanced series outperforms previous generation products by delivering up to 0.4 percent greater conversion efficiency for solar cells. PV16x series photovoltaic metallizations are also suitable for a wide range of printing line widths and processes, which help to meet a variety of photovoltaic market needs. » More
May 20, 2010
DuPont Features customizable, functional inks at LOPE-C
DuPont Microcircuit Materials will exhibit its broad and growing portfolio of customizable, functional inks for both thin-film photovoltaic and printed electronics at LOPE-C – Organic and Printed Electronics Convention. » More
April 21, 2010
Queen’s Award for Enterprise Presented to DuPont for Increasing Energy Efficiency of Solar Cells
Her Majesty the Queen, head of state of the United Kingdom and the Commonwealth, has awarded a Queen’s Award for Enterprise in the Innovation category to DuPont for the continuous development of DuPont™ Solamet® photovoltaic metallization paste. » More
April 13, 2010
New Silver Conductive Inks Target High-Growth Touch Screen and OLED Markets
The new screen printable inks include: DuPont 7723, a low temperature firing silver ink suitable for printing on glass, and DuPont 9169, a low temperature curing Ag ink designed for flexible substrates.
» More
March 29, 2010
DuPont Microcircuit Materials Introduces New Screen Printed Ink Materials for Printed Circuit Boards
DuPont CB500 provides the ‘missing link’ in the evolution of selective electroplating that can cut the number of process steps in half,” said Walt Cheng, global business director -- DuPont Microcircuit Materials.
» More
March 15, 2010
DuPont Circuit & Packaging Materials Opens New Technical Lab in China
This multi-functional lab will enable faster and more efficient technical support for CPM customers in the electronics industry in China, and provide a facility for new product development and process evaluation. » More
March 4, 2010
DuPont to Feature New Products at IPC APEX Expo 2010
New technologies on display will include dry film photoresists and phototooling films for printed circuit board (PCB) imaging, flexible circuit materials, embedded resistor materials and new screen printed inks for PCB fabrication. » More
February 26, 2010
DuPont Exhibits at CPCA 2010 Shanghai, China
DuPont will be featuring its broad offering of technologies for the Printed Circuit Board (PCB) industry at CPCA 2010 in Shanghai, China, March 16 - 18, 2010. » More
February 8, 2010
DuPont MCM Exhibits at Printed Electronics & Photovoltaics Europe, April 13 - 14, 2010
DuPont Microcircuit Materials will exhibit its broad and growing portfolio of customizable, functional inks for both thin-film photovoltaic and printed electronics at the Printed Electronics Europe and Photovoltaics Europe. » More
2009
December 7, 2009
DuPont MCM Exhibits at Printed Electronics USA '09
DuPont Microcircuit Materials (MCM) exhibited at Printed Electronics USA '09, December 2 - 3, in San Jose, CA. At the show, MCM highlighted its 40+ years of experience providing functional inks used in the printed electronics and photovoltaic industries. » More
October 28, 2009
DuPont Microcircuit Materials Introduces GreenTape™ 9K7 LTCC
DuPont Microcircuit Materials (MCM) today announced the introduction of the DuPont™ GreenTape™ 9K7 low temperature co-fired ceramic (LTCC) material system, designed for advanced high-frequency, microwave, and millimetre wave electronic circuit applications within the aerospace, automotive, military, consumer electronics, and telecommunications industries. » More
September 18, 2009
DuPont and Applied Materials Collaborate to Boost Solar Cell Efficiency
DuPont and Applied Materials, Inc. announced a collaboration to advance multiple printing technology that is expected to increase the absolute efficiency of crystalline silicon (c-Si) photovoltaic (PV) solar cells. By increasing the efficiency and yield of solar cells and modules, PV power can become more cost effective versus other forms of energy. » More
September 17, 2009
DuPont Microcircuit Materials Introduces Solamet® PV173 Photovoltaic Metallization Paste
DuPont Microcircuit Materials today announced the introduction of DuPont™ Solamet® PV173 photovoltaic (PV) metallization paste, a new lead-free* front side material for crystalline silicon solar cells. With its high performance and superior environmental properties, Solamet® PV173 is targeted to PV cell and module manufacturers who are seeking technologies with a significantly reduced environmental footprint.
» More
September 8, 2009
DuPont Introduces New Solamet® PV412 Photovoltaic Metallization for Thin Film Solar Technologies
DuPont™ Solamet® PV412 photovoltaic (PV) metallization paste, is the latest in a line of silver conductor materials specifically developed for thin film PV technologies. Thin film PV is projected to be the fastest growing segment of the solar module industry primarily because of its potential to reduce the cost of producing solar-derived energy. » More
July 23, 2009
DuPont to deliver paper on new GreenTape™ LTCC system at IMAPS
A representative of DuPont Microcircuit Materials will present a technical paper on the characterization of an all new DuPont™ GreenTape™ low temperature co-fired ceramic materials system for RF/Microwave packaging applications. » More
July 22, 2009
DuPont MCM to exhibit at Plastic Electronics Europe, 2009
DuPont Microcircuit Materials will exhibit its broad and growing portfolio of customizable, functional inks for both thin-film photovoltaic and printed electronics at the Plastic Electronics Europe, 2009 Conference and Exhibition. » More
June 8, 2009
MCM delivers technical topic at IEEE Photovoltaic Specialists Conference
DuPont Microcircuit Materials representatives today delivered a technical presentation to the photovoltaic industry during the 34th IEEE Photovoltaic Specialists Conference. » More
March 25, 2009
DuPont Microcircuit Materials Presents Research Findings on New Technologies for Photovoltaic Thin Films
Thin film photovoltaics is a key emerging market that we expect will reach up to 1.5 gigawatts in 2009, with an increasing share of flexible and rigid designs utilizing front side metallization inks such as Solamet® PV410 metallization. » More
March 11, 2009
DuPont MCM Featured at Dresden IDTechEx Printed Electronic & Photovoltaic Conference and Exhibitions
DuPont MCM is exhibiting its broad portfolio of customizable, functional inks for both thin-film PV and Printed Electronics. A technical presentation on "Advanced Screen Printable Thin Film PV Front-Side Silver Conductor Compositions" will also be given. » More
March 5, 2009
DuPont Microcircuit Materials and CAD Design Software Integrate LTCC Materials and Processes in CDS Ceramic Design Software to Speed Design
In order to significantly improve cycle time for advanced circuit design, DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, and CAD Design Software have announced the integration of DuPont™ GreenTape™ low temperature co-fired ceramic (LTCC) materials and manufacturing processes into CAD Design Software’s Electronic Design Automation (EDA) design tools for Ceramic (Hybrid/MCM – LTCC) circuit design. » More
February 25, 2009
DuPont Microcircuit Materials Doubles Manufacturing Capacity for DuPont™ Solamet® Metallization Pastes
DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, has announced it recently doubled production capacity and made key quality improvements at its European Electronic Materials Manufacturing Facility in Bristol, U.K. » More
2008
November 19, 2008
DuPont Microcircuit Materials Introduces New Offering for Printed Electronics
Silver conductive ink designed as cost-effective solution for RFID antennae, biosensors, membrane touch switch applications and more.
» More
September 9, 2008
DuPont Microcircuit Materials Features Enabling Technologies at the FISITA World Automotive Conference
DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, will exhibit the latest innovations in automotive electronic ceramic circuits using DuPont thick film compositions at the FISITA World Automotive Conference. » Deutsch
July 31, 2008
DuPont Microcircuit Materials Introduces New Solamet® PV159 for Photovoltaic Solar Cells
This new, advanced material has outperformed competitive metallization pastes in a wide range of processes, and in trials by customers around the world.
June 19, 2008
DuPont Microcircuit Materials Opens New Photovoltaic Technical Center
The center provides research, development and technical support for its customers in the photovoltaic (PV) solar energy industry that use DuPont™ Solamet® thick film metallization pastes.
June 11, 2008
DuPont Electronic Technologies Announces Global Price Increase
DuPont Electronic Technologies cites rising raw material, transportation and energy costs among its reasons for the increase.
June 9, 2008
DuPont Expands Production of Solamet® Photovoltaic Metallization Paste System for Fast Growing Solar Energy Market
To meet the needs of the fast-growing photovoltaic (PV) solar energy market, DuPont today announced that it will expand production of DuPont™ Solamet® thick film metallization pastes at its Electronic Materials DuPont Dongguan Ltd. (EMDD) facility here.
May 27, 2008
DuPont Microcircuit Materials Showcases full range of Innovative Materials for Automotive Electronics at SMT 2008
Products include a full range of thick film hybrid products for the manufacture of ceramic-based circuits, electronic components and high frequency applications such as conductors, resistors, dielectrics, LTCC tape, overglazes and a full range of polymeric products for automotive applications.
May 2, 2008
DuPont to Feature Material Offerings at ECTC 2008
DuPont Electronic Technologies will display its expanding portfolio of laminates, thick films, photoresists and removers for semiconductor packaging at the Electronic Components and Technology Conference.
March 31, 2008
DuPont Microcircuit Materials Highlights New Developments at Printed Electronics Europe DuPont MCM is exhibiting its broad portfolio of customizable, functional inks at the show in stand number 25, where it will also introduce a new printed electronics brochure, titled "New Dimensions in Printed Electronics"
March 24, 2008
DuPont to Present at IDTech Expo 2008 DuPont Microcircuit Materials will participate in IDTech Expo 2008, Europe's largest printed electronics event. This year's show will be held on April 8-9, 2008 at the Martitim Hotel in Dresden, Germany.
January 29, 2008
Matsushita Electric Industrial Co. Adopts New DuPont™ Fodel® 8G Conductor System DuPont™ Fodel® 8G pastes are used in the metallization of the plasma display panel (PDP) front bus electrodes in order to improve image quality and achieve substantial cost savings through dramatically reduced precious metal content.
2006
December 11, 2006
AWR and DuPont Microcircuit Materials Deliver LTCC PDK for Microwave Office Design Suite Applied Wave Research, Inc. (AWR®) and DuPont Microcircuit Materials, part of DuPont Electronic Technologies, today announced the availability of a process design kit (PDK) that enables radio-frequency (RF), microwave, and millimeter wave designers to access the DuPont™GreenTape™ low temperature co-fired ceramic (LTCC) technology within AWR's Microwave Office® 2006 software.
November 20, 2006
DuPont Microcircuit Materials Celebrates 10 Year Anniversary at EMDD, Dongguan, China DuPont was the first multinational company to establish a production facility for thick film microcircuit materials in China. Since its start-up in 1996, EMDD has been serving the rapidly growing China domestic electronics market.
October 12, 2006
DuPont Microcircuit Materials Receives Service Award from Q-Cells Marking five years of successful collaboration, DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, today announced that it is the proud recipient of a Q-Cells Supplier Award for its provision of metallization materials used in the construction of silicon photovoltaic cells.
October 05, 2006
DuPont Microcircuit Materials Scientist Honored at IMAPS DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, today announced that Senior Scientist Roupen Keusseyan will be presented with the William D. Ashman Award by the International Microelectronics and Packaging Society (IMAPS).
May 24, 2006
DuPont Microcircuit Materials Introduces New Lead-Free Fodel® for Plasma Display Panels The new lead-free DuPont™ Fodel® photoimageable thick-film paste enables compliance with lead-free directives, while providing the same cost effective, high performance metallization for PDPs provided by previous generation products.
May 18, 2006
DuPont Announces Advanced Displays Technologies DuPont, a leading supplier of materials to the flat panel display industry, today announced a wide range of recent innovations that provide critical benefits for the performance of displays.
DuPont Media Relations Representative
Media interviews and additional information can be obtained by contacting:
Ellen G. Pressley
Public Relations Representative
919-248-5598
14 TW Alexander Drive
RTP, NC 27709
