The miracles of science™

Select Industry


 

2008



June 19, 2008

DuPont Microcircuit Materials Opens New Photovoltaic Technical Center

The center provides research, development and technical support for its customers in the photovoltaic (PV) solar energy industry that use DuPont™ Solamet® thick film metallization pastes.



June 11, 2008

DuPont Electronic Technologies Announces Global Price Increase

DuPont Electronic Technologies cites rising raw material, transportation and energy costs among its reasons for the increase.



June 9, 2008

DuPont Expands Production of Solamet® Photovoltaic Metallization Paste System for Fast Growing Solar Energy Market

To meet the needs of the fast-growing photovoltaic (PV) solar energy market, DuPont today announced that it will expand production of DuPont™ Solamet® thick film metallization pastes at its Electronic Materials DuPont Dongguan Ltd. (EMDD) facility here.



May 27, 2008

DuPont Microcircuit Materials Showcases full range of Innovative Materials for Automotive Electronics at SMT 2008

Products include a full range of thick film hybrid products for the manufacture of ceramic-based circuits, electronic components and high frequency applications such as conductors, resistors, dielectrics, LTCC tape, overglazes and a full range of polymeric products for automotive applications.



May 2, 2008

DuPont to Feature Material Offerings at ECTC 2008

DuPont Electronic Technologies will display its expanding portfolio of laminates, thick films, photoresists and removers for semiconductor packaging at the Electronic Components and Technology Conference.



March 31, 2008

 


DuPont Microcircuit Materials Highlights New Developments at Printed Electronics Europe DuPont MCM is exhibiting its broad portfolio of customizable, functional inks at the show in stand number 25, where it will also introduce a new printed electronics brochure, titled "New Dimensions in Printed Electronics"



March 24, 2008

 


DuPont to Present at IDTech Expo 2008 DuPont Microcircuit Materials will participate in IDTech Expo 2008, Europe's largest printed electronics event. This year's show will be held on April 8-9, 2008 at the Martitim Hotel in Dresden, Germany.



January 29, 2008

 


Matsushita Electric Industrial Co. Adopts New DuPont™ Fodel® 8G Conductor System DuPont™ Fodel® 8G pastes are used in the metallization of the plasma display panel (PDP) front bus electrodes in order to improve image quality and achieve substantial cost savings through dramatically reduced precious metal content.



 

2007

August 30, 2007

 


DuPont Microcircuit Materials Introduces New Solamet® Photovoltaic Metallization Paste System New Offering Enables Significant Cost Reduction for Solar Cell Manufacturers.



February 19, 2007

 


Picking Up the Latest Trend in Cell Phones DuPont Electronic Technologies (ET) in Research Triangle Park, NC recently hosted The International Wireless Industry Consortium, as part of an interactive technical workshop on handset technologies for multi-mode, multi-band cell phone antenna designs, sponsored by Sony Ericsson.



January 10, 2007

 


DuPont Microcircuit Materials Enables Plasma Television Manufacturers to Improve Picture Quality and Expand Market with 7th Generation DuPont™ Fodel® Conductors DuPont Microcircuit Materials introduces its 7th Generation (7G) of DuPont™ Fodel® photoimageable thick-film pastes for the metallization of the front bus electrode used in plasma display panels (PDPs). The 7G Fodel® pastes provide improved image quality and enable substantial cost reductions.


 

2006

December 11, 2006

 


AWR and DuPont Microcircuit Materials Deliver LTCC PDK for Microwave Office Design Suite Applied Wave Research, Inc. (AWR®) and DuPont Microcircuit Materials, part of DuPont Electronic Technologies, today announced the availability of a process design kit (PDK) that enables radio-frequency (RF), microwave, and millimeter wave designers to access the DuPont™GreenTape™ low temperature co-fired ceramic (LTCC) technology within AWR's Microwave Office® 2006 software.



November 20, 2006

 


DuPont Microcircuit Materials Celebrates 10 Year Anniversary at EMDD, Dongguan, China DuPont was the first multinational company to establish a production facility for thick film microcircuit materials in China. Since its start-up in 1996, EMDD has been serving the rapidly growing China domestic electronics market.



October 12, 2006

 


DuPont Microcircuit Materials Receives Service Award from Q-Cells Marking five years of successful collaboration, DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, today announced that it is the proud recipient of a Q-Cells Supplier Award for its provision of metallization materials used in the construction of silicon photovoltaic cells.



October 05, 2006

 


DuPont Microcircuit Materials Scientist Honored at IMAPS DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, today announced that Senior Scientist Roupen Keusseyan will be presented with the William D. Ashman Award by the International Microelectronics and Packaging Society (IMAPS).



May 24, 2006

 


DuPont Microcircuit Materials Introduces New Lead-Free Fodel® for Plasma Display Panels The new lead-free DuPont™ Fodel® photoimageable thick-film paste enables compliance with lead-free directives, while providing the same cost effective, high performance metallization for PDPs provided by previous generation products.



May 18, 2006

 


DuPont Announces Advanced Displays Technologies DuPont, a leading supplier of materials to the flat panel display industry, today announced a wide range of recent innovations that provide critical benefits for the performance of displays.


 

 

DuPont Media Relations Representative

Media interviews and additional information can be obtained by contacting:
Ellen G. Pressley
Public Relations Representative
919-248-5598
14 TW Alexander Drive
RTP, NC 27709