DuPont gold conductors are thick film compositions for application onto ceramic substrates and dielectric layers by screen printing. These substrates are then fired in a conveyor belt furnace in an oxidizing atmosphere (air) to form interconnect tracks and pads in single- and-mulitiayer microcircuits. Single- and multilayer circuits made with silver bearing conductors also use gold pads as bond areas to interconnect bare interconnections using chip and wire techniques.
In some very high-density applications, gold conductors are used as interconnect conductors and top conductors for soldering and wiring bonding assembly operations.
DuPont offers a dielectric compatible with gold conductors and gold bearing solderable conductors and resistors. Photographic imaging Fodel® dielectric can be used where the ultimate in via resolution is required, reducing the size of interconnecting vias by a factor of 4 vs. the traditional thick film process.
In some very high-density applications, gold conductors are used as interconnect conductors and top conductors for soldering and wiring bonding assembly operations.
DuPont offers a dielectric compatible with gold conductors and gold bearing solderable conductors and resistors. Photographic imaging Fodel® dielectric can be used where the ultimate in via resolution is required, reducing the size of interconnecting vias by a factor of 4 vs. the traditional thick film process.
