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Today a typical cell phone uses between 200 and 500 passive components that consume nearly 40% of the board real estate. As devices such as cell phones, PDAs, digital cameras, and MP3 players converge and reduce in size, board space becomes a scarce resource. By embedding the passive components such as capacitors and resistors, designers can free up valuable space, improve board reliability, increase speed, and realize cost and inventory savings.

DuPont™ Interra™ is designed to meet the emerging challenges in the electronics world to embed discrete and planar passive components into printed circuit boards.

Key features of DuPont™ Interra™ systems:

Interra™ includes a family of ceramic-based, screen printable thick film compositions with a broad range of resistance (10O/sq to 10KO/sq) and capacitance (DK = 3000 @1kHz). Interra™ can provide very high capacitance density for burying high value, low tolerance capacitors leading to smaller board sizes and excellent stability and reliability.

DuPontTM Interra™ ceramic thick film

Used to embed discrete capacitors within multilayer printed wiring boards. »More

DuPont™ Interra™ polymer thick film

Used to embed discrete resistors within multilayer printed wiring boards. »More

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