Fodel® photoprintable thick film products provide a significant denstiy increase in the X-Y plane with no yield penalty. Improved liine and space resolution and decreased via size, increase X-Y density 400-500% relative to conventional screen printed thick film circuits. The photographic nature of the Fodel® process provides circuit layers free of distortion. The elimination of distortion can be particularly beneficial for component attachment on the top circuit layer. These improvements allow the production of high density, thick film circuits that are currently being made with thin film or other competing technologies.
Fodel® 5956 gold conductor is an inner and top layer photoprintable thick film composition specially developed to be compatible with Alumina, Fodel® 6050 dielectric and Green Tape™ Low-temperature cofired ceramic.
When used with Fodel® 6050 dielectric and via fill pastes, Fodel® 5956 offers:
- Extremely high conductors and via density
- Excellent wire bond interconnections
- Multilayer, hermetic circuits
- No screen printing pattern distortion
Fodel® 6050 dielectric paste is a photoprintable, multilayer dielectric capable of resolving 3-mil vias on a 5-mil pitch. The 6050 paste has good leveling performance, providing a very smooth, uniformly dense,fired dielectric free of pinhole defects. Fodel® 6050 dielectric is compatible with:
- Fodel® 5956 Au conductor
- Screen printed Au conductors, 5715 and 5725
- 5727 Via fill Au conductor
When used with DuPont's compatible Fodel® 5956 Au conductor and standard via fill pastes, Fodel® 6050 offers:
- Smallest via diameter and highest via pitch
- Very high via yield
- Consistent via shape
- Smooth, level dielectric surface for better component placement
- Multilayer, hermetic circuits
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