Now available is a complete 943 Low Loss Green Tape™ material system with excellent high frequency performance. Modules are produced by cutting dielectric tape to the desired size, punching interconnecting vias, filling vias with thick film compositions, and patterning interconnect lines on the tape. This process is repeated for each layer in the design. Separate layers are collated, stacked, and laminated, becoming the "green" multi-layer. Co-firing the top layer Au and/or Ag-bearing conductors with the multi-layer module provides the lowest possible production cost. Post-fired processing may be used to apply resistors, specialty conductors and dielectrics.
The complete DuPont™ 943 Low Loss Green Tape™ LTCC Material System provides a technology option for high frequency applications, enabling high density functionality, excellent reliability, low power requirements and low cost interconnect packaging. Minimal dielectric loss is observed to 77 GHz with additional testing at higher frequencies planned.
The system is composed of a glass/ceramic dielectric tape with shrinkage-matched, high conductivity metallization. Cost-effective parallel processing is an advantage versus the sequential processing associated with thick film hybrids.
Typical applications include:
- Automotive
- Military
- RF and Microwave IC packaging
- Opto-electronics
- Wireless and satellite communications
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