Polymer thick film (PTF) products are inexpensive, lightweight, compact and environmentally acceptable. They lend themselves to highly efficient manufacturing techniques. These factors have led to the continuing development of the technology and its use in increasingly complex areas.
Printed on flexible substrates, PTF products can be folded, twisted, bent around corners or bonded to any surface making them ideal for applications where flexibility is needed. The technology is suitable for small features and layers can be printed on top of each other to develop multiple functions. Polymer thick film technology has become the preferred choice for printing electrodes and other components of disposable biosensors.
Printed on ceramic substrates, PTF products are especially suited to harsh environments, (e.g., chemicals, temperature), where a biosensor is expected to have a longer life.
We leverage DuPont chemistry knowledge and precious metal powders technology to develop the state-of-the-art polymeric thick film for various applications such as electronic components, RFID, Smart Cards & Smart Tags, Membrane Touch Switch (MTS) and printed wire board (PWB).
The CB series of polymer thick film materials can meet a wide range of printed circuit challenges. They are excellent screen printing compostions compatible with manual and semi-automatic equipment. All of the materials are compatible with rigid printed circuit board substrates such as FR-4, CEM-1 and phenolic paper, and many are compatible with flexible substrates such as Kapton® polyimide and Mylar® polyester film.
DuPont CB200 for rigid circuit boards is a copper based polymer thick film (PTF) compositions specifically designed to combat electro-magnetic interference (EMI) and provide up to 30% cost savings over conventional EMI shielding.
Circuit designers can reduce layer count, by eliminating 1 or more copper/foil laminate layers, thus creating thinner circuits which saves materials and processing costs. Because the ground plane created by PTF is typically only 1 mil away from circuitry compared with a ground plane in a typical multilayer circuit which is at least 8 mils away —the PTF approach often times gives higher shielding performance.
DuPont CB230 (silver/copper) for additive circuitry, electrodes and termination sites is fully screen printable and solderable and can be used on a wide variety of substrates to create fully additive circuits and crossovers.
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